New LPCP110 Laser Tool Outfitted with Precision Galvanometer Scanner with 150mmx150mm Field Size and X-Y Table Configurations Up To 30"X30"
Press Release Summary:
- Ideal for domestic laser materials processing of printed circuit boards, rigid flex and flexible circuits
- Configured with various laser technologies to meet specific material processing requirements
- Provides modular process heads that shift the tool from large area material removal, part singulation or routing to automotive level drilling for interconnection applications
Original Press Release:
LPCP1100 Laser Tool for Printed Circuit Board, Flex and Rigid Flex Pad Skiving and Material Removal
BOLD Laser Automation, Inc. of Bedford, NH USA, announces a laser tool for domestic laser materials processing of printed circuit boards, Rigid Flex and Flexible circuits.
Designated the LPCP1100 Laser Printed Circuit Processor platform, the laser system provides a cost-effective solution for US domestic printed and flexible circuit manufacturers who are looking for adding tools to gain entry into new automotive and aerospace opportunities.
LPCP1100 can be configured with various laser technologies to meet specific material processing requirements. Outfitted with precision galvanometer scanner with 150mmx150mm field size and X-Y table configurations up to 30”x30”.
LPCP1100 provides modular process heads that shift the tool from large area material removal, part singulation or routing to automotive level drilling for interconnection applications.
For more information and product literature, call 1-855-295-6037 / 1-603-413-5601 or go to www.boldlaserautomation.com or info@boldlaserautomation.com
Company Name: BOLD Laser Automation, Inc.
Address 1: 27 Harvey Road, Unit 4
City: Bedford
State: NH
Zip: 03106
Country: USA
Phone: 603.493.2579
URL: www.boldlaserautomation.com
Contact:
Name: Todd Lizotte
E-mail: todd.lizotte@boldlaserautomation.com
