Press Release Summary:
InFORMS consists of solder with a reinforcing matrix which provides mechanical and thermal reliability, uniform solder bondline thickness, and low-void performance. Also, InFORMS's strong and dependable joints allow for high power densities.
Original Press Release:
Indium Corporation is Redefining Solder with InFORMS Solder Preforms and Ribbon
InFORMS® solder preforms and patent-pending ribbon are composite preforms consisting of solder with a reinforcing matrix. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS® do more than just bond two surfaces.These solder preforms were designed to address some specific challenges to the power electronics industry.
InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS®, check out this video https://www.thomasnet.com/knowledge.php/solder-redefined, or visit www.indium.com/informs.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.