New DesignCore D3RCM Camera Modules are Housed in IP69K Sealed Enclosures

Press Release Summary:

The DesignCore® D3RCM Rugged Camera Modules are offered with on-sensor and internal image signal processing (ISP). The cameras come with Sony or OmniVision image sensors and FPD-Link III SerDes. The unit’s Power over Coax with multiplexed video stream and control channels simplifies system integration. D3RCM camera modules are designed for high-performance automotive and industrial vision applications. The camera’s sealed enclosures feature FAKRA connectors.

Original Press Release:

D3 Engineering Announces Rugged FPD-Linkâ„¢ III Camera Modules for Automotive and Industrial Vision

Small, lightweight, sealed camera modules are designed to IP69K

Rochester, NY – August 2, 2018 – D3 Engineering has introduced a new line of rugged camera modules for automotive and industrial vision. The new DesignCore® D3RCM Rugged Camera Modules integrate OmniVision® or SONY® image sensors with Texas Instruments’ FPD-Link™ III SerDes for full digital performance and superior resolution. The miniature cameras in sealed enclosures are designed to meet IP69K standards.

D3 has drawn on its extensive experience in embedded vision and autonomous systems to create the new product line. Automotive vision applications include Advanced Driver Assistance Systems (ADAS) such as surround view, backup camera, mirror replacement, and blind spot monitoring. Industrial vision applications include unattended surveillance systems, process automation, and machine vision.

DesignCore D3RCM Rugged Camera Modules offer the smallest size, very light weight (less than 10 g excluding lens), and excellent thermal management. Several models feature on-sensor and internal image signal processing (ISP). Power over coax (PoC), with multiplexed video stream and control channel, simplifies system integration.

The rugged camera modules are manufactured with actively aligned optics and 100% unit inspection. The sealed housings have integrated FAKRA connectors. They are designed and manufactured to deliver cost-effective vision in high-performance applications.

Qualification tested and fully validated models are available for automotive production. Other models are production-ready for customer validation. The cameras are available in volumes from 10 to 10,000 or more. 

Sony, OmniVision sensors with FPD-Link III available now; OnSemi sensors and GMLS2 to come

The first DesignCore D3RCM Rugged Camera Modules feature Sony or OmniVision image sensors and FPD-Link III SerDes. Additional modules in development include image sensors from ON Semiconductor and others, along with GMSL2 SerDes.

Model                                                         MP                       Sensor                             FPD-Link™ III                                        Feature

D3RCM-OV10640-953                             1.3MP          OmniVision OV10640                  TI DS90UB953A           Fully validated for automotive systems production

D3RCM-OV10640-913                             1.3MP          OmniVision OV10640                  TI DS90UB913    

D3RCM-OV10640-OV490-913                 1.3MP          OmniVision OV10640                  TI DS90UB913                   With internal ISP OV490

D3RCM-OV10635-913                              1 MP           OmniVision OV10635                  TI DS90UB913                  With on-sensor ISP

D3RCM-IMX290-953                                2.1MP             Sony IMX290                            TI DS90UB953A

D3RCM-IMX390-953                                2.1MP              Sony IMX390                           TI DS90UB953A 

Specifications, price and availability

Download data sheets or purchase camera modules at

Sample quantities are available now from $299. Contact D3 for volume pricing and lead times.

Integration and System Development Support

D3 Engineering helps its OEM customers integrate its rugged camera modules on the OEM’s hardware platform of choice. Camera integration services include custom ISP tuning, software drivers, and verification assistance.

D3 also provides complete embedded system development services on its DesignCore platforms or the customer’s hardware platform. D3RCM Rugged Camera Modules are compatible with D3’s DesignCore Development Kits based on NVIDIA’s Jetson, Intel’s FPGA, and Texas Instruments’ TDA2P, TDA3x, TDA2x, DM50x, and AM57x vision processors. D3 leverages its DesignCore kits to accelerate technology evaluation, prototypes, and vision system development for its customers.

About D3 Engineering

D3 Engineering provides embedded electronic design services for original equipment manufacturers in the industrial, transportation, infrastructure and commercial sectors. Using its proven DesignCore platforms and proven stage-gate development process, D3 Engineering helps its OEM partners minimize the cost, schedule, and technical risks of new product development for performance-critical applications. Specializing in autonomous systems, embedded vision, and connected automation, D3 Engineering provides hardware design, firmware design, validation testing, and transition to production. Learn more at

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