New 50-2151 FR Provides Thermal Shock and Dielectric Properties

Press Release Summary:

  • Thermally conductive potting compounds are formulated to be flame retardant
  • Low exothermic reaction temperature
  • Ideal for potting or encapsulating delicate components

Original Press Release:

Thermally Conductive Polyurethane Potting Compound

Formulated with Large Mass Potting Applications in Mind

A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices. Also, most potting compounds create too much heat when curing in large mass sizes. 50-2151 FR has a low exothermic reaction temperature. This Polyurethane Potting Compound was formulated to provide a good balance between cost and performance.

The 50-2151 FR is low in viscosity and ideal for potting or encapsulating delicate components. This system provides outstanding thermal shock and excellent dielectric properties. An additional feature is that 50-2151 FR is formulated to be flame retardant.

Thank you for considering the release of the new 50-2151 FR Thermally Conductive Potting Compound as a New Product News Release in your publication.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 30 years. Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or

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