Press Release Summary:
- OpenVPX backplanes utilizes BKP3-CEN07-15.2.3 VITA 65 profile
- 7-slot backplane is standardly designed to PCIe Gen3 speeds with options for high levels
- Offered in commercial, development and MIL rugged formats
Original Press Release:
New 3U OpenVPX Backplanes in VITA 65 and VITA 66.4 Optical Formats
Waterloo, Ontario — Sept 15, 2020 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced new 3U OpenVPX backplane designs in multiple configurations.
Pixus has developed OpenVPX backplanes utilizing the BKP3-CEN07-15.2.3 VITA 65 profile. The 7-slot backplane is standardly designed to PCIe Gen3 speeds with options for higher levels. Pixus has also modified the base backplane design to include versions with cutouts for VITA 66.4 contacts for optical interfaces over OpenVPX. The company also offers single slot power and ground OpenVPX backplanes in VITA 65, VITA 67.3, and VITA 66.4 formats.
The OpenVPX backplanes can be utilized in open frame or various 19” rack mountable chassis platform designs. Conformal coating is optional as are populating the Rear Transition Module (RTM) connectors.
Pixus offers OpenVPX backplane/chassis systems in commercial, development, and MIL rugged formats. The company also provides IEEE and Eurocard components for the embedded computer market.
About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs. Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.