New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock

Press Release Summary:

The 20-3035 Syntactic Epoxy is offered in ready-to-use FreezeBond® premixed and frozen syringe. The product is made by incorporating hollow glass microspheres into a proprietary resin blend. The epoxy is designed for various curing agents for creating thermally insulative and lightweight casting. This compound exhibits low dielectric constant, low shrinkage on cure, low moisture absorption, improved buoyancy and water resistance.


Original Press Release:

Encapsulated Parts Weigh Less with a Syntactic Epoxy Potting Compound

Lightweight (syntactic) potting compounds have been used for years in electronics due to their exceptional strength, stiffness, dimensional stability, buoyancy and water resistance. They feature low dielectric constant, low shrinkage on cure, low moisture absorption, outstanding thermal and mechanical shock resistance and weight savings. These unique polymers are made by incorporating hollow glass microspheres into a proprietary resin blend. Using this technology, 20-3035 was developed to weigh half of what most commercially available potting compounds do.

20-3035 is a two component epoxy that can be used with a variety of curing agents to create a tough, thermally insulative and lightweight casting.

In addition to the standard bulk packaging, 20-3035 can be supplied in the ready-to-use FreezeBond® premixed and frozen syringes for elimination of waste and consistent quality.

Samples are readily available and ship within three days.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 30 years. Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com.

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