Needle Bonding Adhesive enhances performance on smaller cannulas.
Press Release Summary:
Suitable for small gauge needle applications, MD® 1406-M Needle Bonding Adhesive reduces chance of cannula substrate failure. Allowing tighter standard deviations, product is optimized for 385 nm LED curing. Product helps manufacturers with use of LED curing without affecting speed and cured mechanical properties.
Original Press Release:
Dymax Introduces MD® 1406-M for Small-Gauge Needle Bonding
Dymax has introduced 1406-M, a next generation needle bonding adhesive for manufacturers looking to switch to LED curing in small gauge needle applications. It provides superior bonding performance on the reduced surface area of smaller cannulas, even after aging and sterilization, to reduce the possibility of cannula substrate failure. Optimized for 385nm LED curing, 1406-M allows for tighter standard deviations and enables small gauge needle manufacturers to enjoy the benefits of LED curing without sacrificing speed or cured mechanical properties.
Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets. The company’s products are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiency and reduce costs. Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.
For additional information, visit www.dymax.com or contact Dymax Application Engineering at info@dymax.com or 860-482-1010.
Contact:
Nermine Abdel-Hakim
Marketing Communications Specialist
Dymax Corporation
(860) 482-1010
