NAND Flash Memory Modules support command queuing.
Press Release Summary:
Available in densities from 16–128 GB, NAND Flash Memory Modules integrate NAND chips fabricated with Toshiba's 15 nm second generation process technology and are fully compliant with JEDEC e-MMC v5.1 standard. Command queuing feature enables users to store multiple tasks in queue, which are then performed in order of user's preference. With secure write protection feature, important data stored in assigned, secure areas cannot be overwritten or erased by unauthenticated users.
Original Press Release:
Toshiba Expands Line-up of e-MMC Version 5.1 Compliant Embedded NAND Flash Memory Modules
Support Command Queuing, Secure Write Protection Features
IRVINE, Calif., -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its JEDEC e-MMC Version 5.1 compliant embedded NAND flash memory products.
Featuring support for command queuing and secure write protection, the modules integrate NAND chips fabricated with Toshiba's 15nm second generation process technology and are fully compliant with the latest e-MMC(TM [1) standard. The new products are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices.
In October 2014, Toshiba launched the industry's first([2) e-MMC products supporting all mandatory features of JEDEC e-MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e-MMC Version 5.1: command queuing and secure write protection.
The command queuing feature enables users to store multiple tasks in a queue, which are then performed in order of the user's preference to enhance performance. It improves the random read performance speed by up to 30 percent([3)Â when compared to existing Toshiba products that do not have command queuing. This feature improves the user experience, allowing the simultaneous execution of multiple applications at the same time - a typical scenario for users of mobile devices such as smartphones and tablets.
The secure write protection feature expands the conventional write protect feature and protects important data stored in assigned, secure areas from being overwritten or erased by unauthenticated users.
"Toshiba has been supporting e-MMC Version 5.1 since it first came out last year for a wide variety of applications," noted Scott Beekman, director of managed NAND memory products for TAEC. "The addition of these optional Version 5.1 features further enhances our product offering, and points to Toshiba's continued leadership role in NAND flash and embedded memory solutions."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.
Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 16GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications. Sample shipments of the 16GB and 64GB products begin today, with additional densities (including 32GB and 128GB) to follow. For additional company and product information, please visit http://www.toshiba.com/taec/.
New Product Lineup
Product Name | Capacity | Category | Package | Mass Production |
THGBMHG7C2LBAIL | 16GB | Supreme | 11.5x13x0.8mm | 2Q, 2015 (Apr.-Jun.) |
THGBMHG8C4LBAIR | 32GB | 11.5x13x1.0mm | 2Q, 2015 (Apr.-Jun.) | |
THGBMHG9C8LBAIG | 64GB | 11.5x13x1.2mm | 2Q, 2015 (Apr.-Jun.) | |
THGBMHT0C8LBAIG | 128GB | 11.5x13x1.2mm | 2Q, 2015 (Apr.-Jun.) |
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*In Toshiba e-MMC categories, "Supreme" represents products suited to high-end class applications.
Key Features
1. The JEDECe-MMC Version 5.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features([)(4)() standardized in JEDECe-MMC Version 5.1, such as BKOPS control, Cache Barrier, Cache Flushing Report and Large RPMB Write, are applied to the new products to enhance usability.
2. The random read performance can be improved by up to 30 percent (max.)([)(3)() by applying the "command queuing feature," one of the new optional features of JEDECe-MMC Version 5.1.
3. Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video([)(5)().
Key Specifications
Interface | JEDECe-MMC V5.1 standard HS-MMC interface |
Capacity | 16GB, 32GB, 64GB, 128GB |
Power Supply Voltage | 2.7-3.6V (Memory core) 1.7V-1.95V, 2.7V-3.6V (Interface) |
Bus Width | x1, x4, x8 |
Temperature Range | -25 degrees C to +85 degrees C |
Package | 153Ball FBGA 11.5mm x 13.0mm |
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Notes
[1Â Â Â e-MMC(TM) is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association. The latest JEDEC e-MMC Version 5.1 specification was officially issued by JEDEC on February 24, 2015.
[2Â Â Â As of October 2, 2014. Toshiba survey.
[3Â Â Â Toshiba survey.
[4Â Â Â "BKOPS control" is a function where the host allows the device to perform background operation when the device is idle. "Cache Barrier" is a function that controls when cache data is written to the memory chip. "Cache Flushing Report" is a function that informs the host if the device's flushing policy is FIFO (First In First Out) or not. "Large RPMB write" is a function that enhances the data size that can be written to the RPMB area to 8KB.
[5Â Â HD and SD are calculated at average bit rates of 17Mbps and 7Mbps, respectively.
The products are labeled based on the memory chip(s) it contains, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.
(For purposes of measuring memory capacity in this context, 1GB = 1,073,741,824 bytes.)
*Read and write speeds are calculated as 1MB/s = 1,000,000bytes/s.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
© 2014 Toshiba America Electronic Components, Inc. All rights reserved.
COMPANY CONTACT:
Rebecca Bueno
Toshiba America Electronic Components, Inc.
Tel.: (949) 462-7885
rebecca.bueno@taec.toshiba.com
