New Module Allows Bonding of Internet Lines Optimized for Real-Time Applications With Low-Latency Requirements
SAN DIEGO - Mushroom Networks, Inc., innovators of Broadband Bonding(TM) technology, announced today the launch of a new Real Time Broadband Bonding technology for its broadband bonding appliances at the 2012 Interop Las Vegas show.
Businesses leveraging public and private cloud based services can suffer from unstable latency on WAN links caused by fluctuations of the Internet pipe and clogged WAN connectivity from non-real-time traffic overtaking the bandwidth. Real-Time Broadband Bonding technology not only brings more bandwidth by combining up to 12 Internet lines via the Internet bonding device, but also intelligently manages the bonded WANs to optimize latency and provide QoS over the new bonded IP pipe for real-time applications.
Mushroom Networks will demonstrate the new Real Time Broadband Bonding technology at booth #2352 at Interop Las Vegas, May 8th through 10th. The Real-Time Broadband Bonding module combined with the QoS module enables clients to use real-time voice and video applications in conjunction with their non real-time traffic. Users of both public and private cloud services can see decreased connectivity performance from fluctuating WAN conditions or when non real-time traffic is placed into their IP pipe. Mushroom Network's proprietary Real-Time Broadband Bonding technology intelligently manages the bonded WAN to ensure minimized latency and optimal QoS for real-time applications within the bonded IP pipe.
"Our new Real-Time Broadband Bonding technology is ideal for applications that require low latency to and from the data-centers," said Dr. Cahit Akin, CEO of Mushroom Networks. "This new technology allows our clients to run heavy real-time applications such as VoIP, video and other interactive chatty cloud applications over this low latency bonded IP tunnel to get high responsiveness for best user experience."
Mushroom Networks is also announcing at Interop Las Vegas the availability of the Truffle Performance Pack, a high performance version of its Truffle Broadband Bonding appliance. Supporting up to 940 Mbps Broadband Bonding capability, ideal for the data-center side of multi-office installations. Broadband Bonding provides a better performance, higher reliability and cost effective alternative to MPLS networks for site-to-site connectivity.
Interop drives the adoption of technology, providing knowledge and insight to help IT and corporate decision-makers achieve business success. Interop Las Vegas is the flagship event held each spring, with Interop New York held each fall, with annual international events in Mumbai and Tokyo, all produced by UBM TechWeb and partners. For more information, visit www.interop.com.
For more information about Truffle and to inquire about pricing call (858) 452-1031 or visit www.mushroomnetworks.com/.
About Mushroom Networks
Mushroom Networks, Inc. is a privately held company based in San Diego, CA, providing patent pending Broadband Bonding solutions to a range of Internet connection applications. The company's flagship product line serves SMBs, enterprises, multi-tenant buildings, and broadband service providers and bonds dissimilar broadband access technologies forming a single highly reliable broadband pipe that can easily scale based on needs. Mushroom Networks was a finalist for the coveted 2012 San Diego Business Journal Innovation Award, XCHANGE Tech Innovators Xcellence Award, 2007 CONNECT® 'Most Innovative New Product' award, 2008 CONNECT® 'Most Innovative New Product' award, Network World's "top technology trend of 2008" award, and nominated for the best investment opportunity within the fixed telecom sector by Telecom Council of Silicon Valley. For more information, please visit www.mushroomnetworks.com/ or call 858-452-1031.
Mushroom Networks, Inc.
CONTACT: General, Mushroom Networks, Inc., +1-858-452-1031, email@example.com
Web Site: www.mushroomnetworks.com