Multicore Processor supports mobile backhaul.

Press Release Summary:



Consisting of asymmetrical multicore SoC, LCP Link Communication Processor supports all major protocols, enabling wireless, mobile backhaul, multiservice, router, and broadband access traffic to be migrated from TDM networks to next-generation Ethernet and MPLS networks. LCP performs multiprotocol processing at wire speed using dedicated, on-chip programmable cores. Connectivity is provided by integrated gigabit Ethernet interfaces, enabling direct WAN uplinks.



Original Press Release:



LSI Announces Next-Generation Multiservice Processor for Wireless Networks



Highly scalable asymmetric multicore processor enables cost-effective, multiprotocol support and mobile backhaul in a system on a chip (SoC)

MILPITAS, Calif., -- LSI Corporation (NYSE: LSI) today announced its next-generation link communication processor (LCP) designed to allow migration of network traffic to IP-based networks. The LCP is a significant addition to the LSI(TM) family of multiservice processors and a key part of the LSI asymmetric multicore processor portfolio that enables any-to-any communications in wireless infrastructure.

An asymmetrical multicore system on a chip (SoC), the new LCP is based on the highly successful LSI link layer processor. It supports all major protocols, enabling wireless, mobile backhaul, multiservice, router and broadband access traffic to be easily and efficiently migrated from current-generation, time-division multiplexing (TDM) networks to next-generation Ethernet and multiprotocol label switching (MPLS) networks at much lower cost and risk than previous solutions.

The LCP performs multiprotocol processing at wire speed using dedicated, on-chip programmable cores. It contains multicore ARM processors for managing data plane applications, and running customer-specific application code. Connectivity is provided by integrated gigabit Ethernet interfaces, enabling direct wide area network (WAN) uplinks. In addition, the LCP scales across a broad range of network speeds, from T1/E1 to STM-1/OC-3, which allows networking OEMs to leverage a single development effort across all major services and performance levels.

"The complex mix of protocols and applications that run on today's advanced networks require highly integrated, multicore SoCs with proven software," said Shane Gunning, multiservice marketing director, Networking Components Division, LSI. "Our latest-generation LCP provides OEMs with a single, scalable, highly efficient platform that enables them to build multiservice base stations and controllers that span 2G, 3G and 4G networks."

In wireless applications, the LCP SoC supports backhaul of BTS (2G) and Node B (3G) traffic to BSC (2G) and RNC (3G) controllers. Similarly, the new multicore LCP enables the transport of multiple standard protocols across wireline packet networks. The LCP continues to operate in the event of a planned or unplanned system reboot, and, because of its unique protection switching and warm restart features, it can minimize network downtime due to system or card failure.

The new LSI link layer communication processor is expected to sample in March, 2010. LSI will showcase its latest wireless solutions in stand AV64 at the GSMA Mobile World Congress in Barcelona, Spain, February 15 to 18. The LSI stand is located midway along the Avenue near the crosswalk between the Courtyard and Hall 8 of the exhibition.

As part of a comprehensive Multicore Done Right(TM) approach, the new LSI networking portfolio provides best-in-class solutions for wireless infrastructure. Additional information on the LSI LCP can be found on the LSI website at:
http://www.lsi.com/DistributionSystem/AssetDocument/LSI_PB_2pg_LCPb_LR.pdf

About LSI

LSI Corporation (NYSE:LSI) is a leading provider of innovative silicon, systems and software technologies that enable products which seamlessly bring people, information and digital content together. The company offers a broad portfolio of capabilities and services including custom and standard product ICs, adapters, systems and software that are trusted by the world's best known brands to power leading solutions in the Storage and Networking markets. More information is available at www.lsi.com.

CONTACT: Dan Devine of LSI Corporation, +1-610-712-6802, dan.devine@lsi.com

Web Site: www.lsi.com/

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