Multi-Chip Solution performs for USB-to-RS232 interfacing.
Press Release Summary:
USB-DUO bundles USB bridge controller ICs with RS232 transceiver IC, providing platform for creating USB-to-RS232 converter cabling systems supporting speeds up to 250 Kbps. While FT231XS provides USB-to-UART conversion operation, FT3243S transceiver provides digital-to-RS232 conversion – translating 3.3 V level UART signal from FT231XS to RS232 voltage levels. Product operates from -40 to +85°C and draws 9 mA when active or 135 µA when FT231XS X-Chip element is in suspend mode.
Original Press Release:
FTDI Introduces Multi-Chip Solution for Developing USB-to-RS232 Systems
Delivering enhanced functionality, streamlined implementation & reduced overall cost
USB solutions specialist FTDI Chip, through its highly acclaimed X-Chip series, has now added to its portfolio of semiconductor solutions for USB-to-RS232 interfacing. FTDI Chip's USB-DUO offering bundles together one of the company's new high performance USB bridge controller ICs with its RS232 transceiver IC, in order to furnish engineers with a platform on which they can create their own USB-to-RS232 converter cabling systems - supporting speeds of up to 250 kbits/s. The company's FT231XS provides the USB-to-UART conversion operation while the FT3243S transceiver provides the digital-to-RS232 conversion, translating the 3.3 V level UART signal from the FT231XS to RS232 voltage levels.
The USB-DUO product benefits from the feature-rich composition of two ICs. The FT231XS's internal EEPROM memory handles storage of USB configuration data and allows for customising of the device descriptors to match an OEM's particular description preference. An internal phased-locked-loop (PLL) provides system timing. The FT3243S transceiver has a built-in transient voltage suppressor (TVS), complying with the EN6100-4-2 standard of ±15 kV for air gap discharge. This means that additional electro-static discharge (ESD) protection circuitry is not called for. By streamlining this offering, with a minimal number of external components being required, OEMs can reduce both the bill of materials (BoM) and the PCB area required to implement their complete system design.
The USB-DUO solution exhibits very low overall power consumption, drawing just 9 mA when it is active and a mere 135 µA while its FT231XS X-Chip element is in suspend mode. Additionally, as it is capable of supporting an operational temperature range covering -40 °C to 85 °C, this solution is suitable for use in demanding industrial settings.
"By combining two of our interface chips into one highly integrated product we can offer the industry a solution that is optimised for space constrained and cost-sensitive designs. This will allow engineers to bring the convenience of USB connectivity to legacy systems." states Fred Dart, CEO and founder of FTDI Chip.
Pricing for the USB-DUO solution is US $1.98 in quantities of 10,000 units.
Further information on these products can be found at: http://www.ftdichip.com
About FTDI Chip
FTDI Chip specialises in the design and delivery of advanced silicon and software solutions. The company focuses on providing engineers with feature-rich, easy to use, robust products that will speed to market and reduce development costs. Widely recognised for its broad portfolio of Universal Serial Bus (USB) products, FTDI Chip can offer a simple route to USB migration by combining easy-to-implement ICs with proven, ready-to-use, royalty-free firmware and driver software. It has everything from simple bridge devices for converting USB from RS232, RS422, RS485, I2C, SPI, etc, to highly integrated system solutions with built in microcontrollers and sophisticated development platforms.
FTDI Chip has now further expanded its “made easy” philosophy, with the addition of simple to use display controllers that combine display, audio and touch functionality in a single compact package with accompanying development software, for creating Graphic User Interfaces (GUIs) suitable for a wide variety of low-power microcontrollers.
FTDI Chip is a fab-less semiconductor company, headquartered in Glasgow, UK, with research and development facilities located in both Glasgow, Singapore and Taipei, Taiwan, plus regional sales and technical support sites in Glasgow; Portland, Oregon, USA; Shanghai, China; and Taipei.
More information is available at http://www.ftdichip.com
Regional sales offices and distributor lists are available at http://www.ftdichip.com/FTSalesNetwork.htm
For further information and reader enquiries:
Dave Sroka
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, UK
Tel: +44 (0) 141 429 2777Â Â Fax: +44 (0) 141 429 2758
E-mail: marketing@ftdichip.com
Issued by:
Mike Green
Pinnacle Marketing Communications Ltd
Tel: +44 (0)20 84296543Â
E-mail: m.green@pinnaclemarcom.com
Web: www.pinnacle-marketing.com
