MOSFET BGAs work with battery packs.

Press Release Summary:




FDZ2551N and FDZ2553N dual N-channel and FDZ2552P and FDZ2554P P-channel 20 V MOSFET ball grid arrays have physical and electrical characteristics that are suitable for Li-Ion battery pack protection applications. Each BGA is housed in 4 x 2.5 mm surface mount package, and has common drain connection and 0.8 mm mounted height. RDS(On) is 28 mohm and 14 mohm for N and P channel devices, respectively. They are available in tape-and-reel packaging.




Original Press Release:



Dual N- And Dual P-Channel MOSFET BGAS Combine Small Footprint, Low Profile, Low Rds(On), And Low Thermal Resistance: Ideal For Li-Ion Battery Pack Protection



San Jose, Calif.-July 29, 2002- Fairchild Semiconductor International (NYSE: FCS) introduces two new dual N-channel and two new dual P-channel 20V MOSFET BGA (ball grid array) products with physical and electrical performance characteristics ideal for Li-ion battery pack protection applications. Each of the four devices (FDZ2551N, FDZ2553N, FDZ2552P and FDZ2554P) is housed in a 4 x 2.5mm surface mount MOSFET BGA package featuring a common drain connection. BGA packaging results in a small footprint (10mm²), a very low profile (0.8mm maximum mounted height), excellent RDS(On) and outstanding thermal performance, while further enhancing performance by allowing for topside heat sinking. In addition to optimizing Li-ion battery protection circuitry for size and performance, the dual N- and P-channel MOSFET BGAs very effectively address the needs of other space-sensitive, performance-oriented load management applications used in computer/EDP, communication, portable, industrial equipment and wireless communication products, such as cell phone handsets, PDAs, Web tablets, MP3 players, and portable POS terminals.

These 4 x 2.5mm BGA devices offer significant benefits over conventional leaded packages. With a profile approximately 21% lower than a TSOP-6 package, the MOSFET BGAs can achieve up to 79% lower RDS(On) (28 milliohms vs. 135 milliohms) than the most competitive dual 20V, TSOP-6 P-channel MOSFET. They also provide 80% lower RDS(On) (14 milliohms compared to 69 milliohms) than the best competitive dual 20V, TSOP-6 N-channel MOSFET on the market today! In addition to the lower absolute RDS(On) values, the dual MOSFET BGAs also boast a lower FFOM (Footprint Figure of Merit, defined as RDS(On) x footprint area) than any other TSOP-6 package or micro lead frame package, such as the PowerPAK(TM) 1212-8.*

"The common drain connection offered by this series of dual MOSFET BGA products make them particularly easy to implement in battery pack protection circuits," said Steve Ahrens, Director of Fairchild Discrete Power Business Development and Communications. "Without the need for additional external package connections, BGAs save space and eliminate additional mounting costs."

Fairchild is the only manufacturer in full volume production of MOSFET BGAs, including a full line of single- and dual- packaged, N-channel and P-channel devices. The FDZ255IN, FDZ2553N, FDZ2552P and FDZ2554P are available in tape-and-reel packaging.

Availability: Samples and production quantities are available now, with lead times of 8 weeks or more for larger orders.

For more information, contact Fairchild Semiconductor's Customer Support Center at (888) 522-5372, fax (972) 910-8036, or visit Fairchild's website at www.fairchildsemi.com.

Datasheets in PDF format are available at:
http://fairchildsemi.com/pf/FD/FDZ2551N.html
http://www.fairchildsemi.com/pf/FD/FDZ2553N.html
http://www.fairchildsemi.com/pf/FD/FDZ2552P.html
http://www.fairchildsemi.com/pf/FD/FDZ2554P.html

Fairchild Semiconductor International: Fairchild Semiconductor International (NYSE: FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, USA and numerous locations around the world. Please contact us on the web at www.fairchildsemi.com.

*PowerPAK is a trademark of Siliconix Inc.

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