MOSFET BGAs provide load switching in portable applications.
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Press Release Summary:
P-Channel MOSFET Ball Grid Arrays do not require external charge pump circuitry and are 2.5 V/4.5 V gate-driven specified, enabling them to be driven directly from integrated circuits in battery power applications. Footprint dimensions range from 2.0 x 2.0 mm to 3.5 x 4.0 mm. Units offer designers Footprint Figure-of-Merit (FFOM) significantly lower than devices housed in SC-70, SO-8, TSSOP-8, SSOT-3, and SSOT-6 packages.Original Press Release:
Industry's First Volume-Produced P-channel MOSFET BGAs Combine Small Footprint With Low RDS(on); Offer An Ideal Solution For Load Switching In Portable Applications
San Jose, Calif.-May 16, 2002- Fairchild Semiconductor International (NYSE: FCS) introduces four new P-channel MOSFET BGAs that combine exceptionally small physical size with low RDS(on) to deliver a highly effective solution for load switching in portable, wireless, and networking applications. The new Ball Grid Array (BGA) packaged devices, with footprint dimensions ranging from 2.0 x 2.0 mm to 3.5 x 4.0 mm, offer designers concerned with optimizing space utilization a "Footprint Figure-of-Merit" (FFOM) significantly lower than competitive devices housed in SC-70, SO-8, TSSOP-8, SSOT-3, SSOT-6, or other common packages (FFOM is defined as RDS(On) x footprint). Space utilization is further enhanced because these P-channel devices do not require external charge pump circuitry, and are 2.5V/4.5V gate-drive specified, enabling them to be driven directly from integrated circuits in battery power applications.
"As a load management solution for battery operated products," said Jingo Sarkis, Director of Marketing for the Communications Market Segment, Fairchild Discrete Power Technologies Group, "these new P-channel MOSFET BGAs are a significant advancement over conventionally-packaged devices. Cell phones, PDAs, pagers-applications requiring maximum space utilization and extended battery life-all benefit from the superior FFOM, low profile, and simple interface that our new P-channel MOSFET BGAs provide."
Fairchild is the only manufacturer in full volume production of MOSFET BGAs in various sizes, offering a full line of single- and dual-packaged, N-channel and P-channel devices. The improved silicon and package characteristics allow MOSFET BGAs to offer superior thermal performnance, while being capable of the same junction-to-ambient thermal resistance as an SO-8 package. The top-side heat-sinking capability of the BGA package also allows for increased current density, without consuming additional board area.
The FDZ202P, FDZ204P, FDZ206P, and FDZ208P are available in tape-and-reel packaging. Product Price and Information:
Availability: Samples and production quantities are available now, with lead times of 8 weeks or more for larger orders.
For more information, contact Fairchild Semiconductor's Customer Support Center at (888) 522-5372, fax (972) 910-8036, or visit Fairchild's website at www.fairchildsemi.com.
Fairchild Semiconductor International:
Fairchild Semiconductor International (NYSE: FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading-edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial, and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, USA and numerous locations around the world. Please contact us on the web at www.fairchildsemi.com.
