Modular I/O Platform is intended for OEM and ODM designs.

Press Release Summary:



Model G700 features Intel® I/O Acceleration Technology, Intel® 64 Architecture, and Intel® Virtualization Technology in 2U chassis with hot swappable fans, power supplies, and removable hard drives. With 8 cores/platform, unit utilizes E5335 processor and Intel® 5000P chipset. Modular options for GbE (copper and fiber), 10GbE, Infiniband, storage, and security acceleration for IPSec and SSL provide solution for networking, storage, and security appliance applications.



Original Press Release:



Flextronics Unveils G700 Quad Core Intel® Processor-Based Platform



Modular I/O Ideal for Networking, Security and Storage Appliances

SINGAPORE, April 3 // -- Flextronics today unveiled its new G700 Quad-Core platform for OEM and ODM designs. The scalable G700 utilizes the Quad-Core Intel® Xeon® processor E5335 and the Intel® 5000P chipset and maximizes available PCI Express I/O through modularity.

"We developed a flexible rackmount platform containing two Quad-Core Intel® processors for customers seeking a high-performance, scalable solution for various networking, security and storage appliance applications," said Sean Burke, President of Flextronics' Computing Segment. "With its modular I/O approach, OEM and ODM customers can increase value to end users and offer various G700 models with options for gigabit Ethernet (copper and fiber), 10GbE, Infiniband, storage, security acceleration for IPSec and SSL and many more modular options."

Burke added, "Today's announcement underscores our commitment to provide OEM and ODM customers with the right platforms and technologies to increase their competitiveness in a dynamic market. Flextronics' ability to design and manufacture Intel Architecture based motherboards and solutions supports our strategy to deliver enhanced services to our customers, and reinforces our position as a leader in advanced ODM and EMS products and services for customer branded systems and solutions."

"The availability of innovative systems with the latest Intel technologies, such as the Flextronics G700 platform, means that OEM/ODM customers can build high performance systems and get to market very quickly," said Joe Jensen, General Manager of Intel's Embedded Markets Division. "The Quad-Core Intel® Xeon® processor doubles the compute density over previous dual-core Intel® processors to meet the needs of intensive workloads in network, security and storage appliance applications."

The G700 includes eight cores per platform, which provides breakthrough performance and energy-efficiency for high performance network appliance and security appliance applications such as firewalls, unified threat management, intrusion detection systems, network attached storage and other filtering applications. A G700 based on the Quad-Core Intel® Xeon® processor and associated Intel® 5000P chipset also provides an excellent solution for intense computing and I/O-intensive workloads within high-end communications and enterprise systems. This includes rack-mount servers, as well as NAS and SAN systems and other graphics intensive workstation environments in modeling, imaging and design environments.

The superior performance is available off-the-shelf as the G700 base system or highly customized version specific to OEM/ODM customer requirements. The G700 features Intel® I/O Acceleration Technology, Intel® 64 Architecture, and Intel® Virtualization Technology in a 2U chassis with hot swappable fans, powers supplies, and removable Hard Drives.

About Flextronics

Headquartered in Singapore (Singapore Reg. No. 199002645H), Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design, engineering and manufacturing services to automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEMs. With fiscal year 2006 revenues from continuing operations of US$15.3 billion, Flextronics helps customers design, build, ship, and service electronics products through a network of facilities in over 30 countries on four continents. This global presence provides design and engineering solutions that are combined with core electronics manufacturing and logistics services, and vertically integrated with components technologies, to optimize customer operations by lowering costs and reducing time to market. For more information, please visit www.flextronics.com/ .

As an Associate Member of the Intel® Communications Alliance, a community of communications and embedded developers and solution providers, Flextronics has the development expertise to provide faster time-to-market designs for the applied computing marketplace. For more information, please visit http://www.intel.com/go/ica.

FCMN Contact: renee.brotherton@flextronics.com

Source: Flextronics International Ltd.

CONTACT: Renee Brotherton, Senior Director of Corporate Marketing, +1-408-576-7189, or renee.brotherton@flextronics.com

Web site: www.flextronics.com/

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