MMIC Core Chip includes transmit and receive modes.
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Press Release Summary:
Operating from 2.5-4 GHz, Model XZ1001-BD consists of integrated transmit/receive switches, low noise amplifier, 6-bit phase shifter, 6-bit attenuator, and drive amplifier. Gallium arsenide core chip, featuring compensated on-chip gate bias, delivers 33 dB transmit/receive gain, 20 dBm transmit/receive P1dB, and 2.5 dB receive noise figure. MMIC chip is suited for both military and weather phased array radar applications as well as satellite communications systems.
Original Press Release:
"M/A-COM Tech Asia Launches 2.5 to 4 GHz Highly Integrated Core Chip with Transmit and Receive Modes of Operations
XZ1001-BD Consists of Integrated Transmit/Receive Switches, Low Noise Amplifier, 6-bit Phase Shifter, 6-bit Attenuator and Driver Amplifier
Hsinchu, Taiwan - M/A-COM Tech Asia introduced today a 2.5 to 4 GHz gallium arsenide
(GaAs) monolithic microwave integrated circuit (MMIC) core chip, which consists of integrated transmit/receive switches, a low noise amplifier (LNA), a 6-bit phase shifter, a 6-bit attenuator and a driver amplifier. This core chip, identified as XZ1001-BD, features compensated on-chip gate bias and delivers 33 dB transmit/receive gain, 20 dBm transmit/receive P1dB, and 2.5 dB receive noise figure. The XZ1001-BD is well suited for both military and weather phased array radar applications and satellite communications systems.
"Our highly integrated S-band core chip is comparable to our X-band core chip, the XZ1002-BD, only shifted down in frequency for 2.5-4 GHz applications," says Peter J. Hales, Senior Director, M/A-COM Tech Asia. "We are showcasing both of these core chips at European Microwave Week to demonstrate 2-chip phased array radar solutions, which
significantly reduce design time, save board space, increase reliability and lower overall costs."
M/A-COM Tech Asia performs 100% on-wafer RF, DC and output power testing on the XZ1001-BD, as well as 100% visual inspection to MIL-STD-883 method 2010. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.
Production samples and parts are available today from stock. The XZ1001-BD datasheet and additional product information can be obtained from the M/A-COM Tech Asia website at www.macomtechasia.com.
ABOUT M/A-COM TECH ASIA
M/A-COM Tech Asia designs and develops monolithic microwave integrated circuits (MMICs) for microwave and millimeter-wave applications. Our products include multifunction chips, high power amplifiers, low noise amplifiers (LNAs), attenuators and phase shifters, as well as complete transceiver chipset solutions for military and weather radar, satellite communications, communications array, air traffic control and active electronic scanned array (AESA).
M/A-COM Tech Asia (formerly Mimix Asia) is a subsidiary of holding company M/A-COM Technology Solutions Holdings, Inc. This holding company and its subsidiaries, including M/A-COM Technology Solutions and Mimix Broadband, make up the M/A-COM Tech family of companies.
MEDIA CONTACT:
Julie Teinert
713-503-6918
Julie.Teinert@macomtech.com
