MIL-STD-1553 BGAs minimize size, weight, and power (SWaP).

Press Release Summary:




Operating from -55 to +125°C, Micro-ACE® TE and Total-ACE® MIL-STD-1553 BGA packages are DO-254 certifiable; support MIL-STD-1553 A/B, MIL-STD-1760, STANAG 3838, and MacAir; and are designed to minimize SWaP (size, weight, and power). Micro-ACE® TE terminals integrate 1553 protocol, memory, and transceivers in plastic BGA package, while Total-ACE® further integrates 1553 transformers to offer complete solution for one dual redundant MIL-STD-1553 channel.





Original Press Release:



"Mil-Temp Micro-ACE(R) TE and Total-ACE(R) MIL-STD-1553 BGA's Minimize Size, Weight, and Power (SWaP)!"



Bohemia, New York -- Data Device Corporation (DDC) introduces Mil-Temp versions of its field-proven and highly efficient Micro-ACE® TE and Total-ACE® MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations. The Micro-ACE® TE terminals integrate 1553 protocol, memory, and transceivers in a small plastic BGA package that is lightweight and small-sized to save board space, weight, and power. The Total-ACE® further integrates 1553 transformers to offer a complete solution for one dual redundant MIL-STD-1553 channel.



Benefits include:

• Operating Temperature: -55°C to +125°C

• Minimize SWaP (Size, Weight, and Power)

- Small Footprint Saves Board Space and Decreases Weight

- Low Power Dissipation

• DO-254 Certifiable

- Field Proven and Reliable Technology with over 200 Million Hours of In-Service History

• Supports MIL-STD-1553 A/B, MIL-STD-1760, STANAG 3838, and MacAir



“These efficient and highly reliable Micro-ACE® TE and Total-ACE® components are ideal for extended temperature range applications where board space is limited, and weight and power are at a premium”, stated Sean Sleicher, DDC’s Data Bus Marketing Manager.



Data Device Corporation (DDC) is the world leader in the design and manufacture of high-reliability data bus, motion control, and solid-state power controller products for aerospace, defense, and industrial automation applications. For more than 45 years, DDC has continuously advanced the state of high-reliability data communications and control technology for MIL-STD-1553, ARINC 429, Synchro/Resolver interface, and Solid-State Power Controllers with innovations that have minimized component size and weight while increasing performance. DDC offers a broad product line of advanced data bus technology for Fibre Channel networks; MIL-STD-1553 and ARINC 429 Data Networking cards, components, and software; Synchro/Resolver interface components; and Solid-State Power Controllers and Motor Drives. DDC headquarters along with our design and manufacturing operations are located in Bohemia, NY. For more information, visit www.ddc-web.com.

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