Microsemi Shipping Production-qualified SmartFusion2 SoC FPGAs and Full-featured Development Kit
Company Delivers Unprecedented Integration of Mainstream FPGA Features with Advanced Security, Reliability and Low Power
ALISO VIEJO, Calif. – Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced shipment of production-qualified SmartFusion®2 system-on-chip (SoC) field programmable gate arrays (FPGAs). The company also announced the availability of its full-featured SmartFusion2 development kit with support for mainstream industry interfaces.
Since the SmartFusion2 introduction in October 2012, Microsemi has engaged with over 400 customers worldwide, and the device family has been adopted into numerous customer systems in the communications, industrial and defense markets. Microsemi's lead customer program, coupled with the early availability of SoC development tools and now production-qualified devices and a development kit, enables customers to ramp to manufacturing volumes in a timely manner.
"With scores of active customer engagements, it is gratifying to note that more than 30 percent of these are new customers that have never used Microsemi FPGAs before, validating our strategy to provide differentiated FPGA-based SoCs for the marketplace," said Paul Ekas, vice president of marketing for Microsemi. "Customers seeking to design with mainstream FPGA features, including high-speed SERDES, DDR3 memory controllers and integrated math blocks, can now do so on the industry's lowest power, most secure and SEU-immune SoC FPGA."
"HMS is delighted that SmartFusion2 has gone into volume production. The SmartFusion2 SoC FPGAs provide an ideal secure and flash-based programmable system-on-chip platform that addresses our existing customer requirements and tomorrow's expectations," said Staffan DahlstrÖm, CEO, HMS Networks. "The combination of a non-volatile FPGA that does not require an external boot device and a compact, low-power ARM® Cortex™ M3 processor is ideal for our small form-factor industrial networking systems. Moreover, the built-in security features of these FPGAs will prove to be useful for future customers who are building highly secure versions of these systems. We look forward to continuing the strategic relationship we have with Microsemi and will continue to build on SmartFusion2 SoC FPGAs as a key element in our solutions for demanding industrial network applications."
Designers of safety-critical, industrial networking and high availability communications systems now no longer have to compromise between mainstream features and the added benefits of superior reliability and security that SmartFusion2 SoC FPGAs provide. The production silicon is available with a complete ecosystem of software, IP and design kits that enable customers to deploy low-risk solutions.
"The breadth and depth of Microsemi's product offering allowed us to integrate several of our industry-leading devices into the SmartFusion2 development board, and deliver a robust design solution that features programmability, embedded processors, timing solutions and PoE functionality all in one platform," said Ekas. "As a result of our system solution approach, product architects have the flexibility of using a single, cost-effective and high-performance design platform for multiple products."
SmartFusion2 Development Kit Features
• SmartFusion2 M2S050T-FGG896 SoC FPGA
- 56K logic element, 256Kbit eNVM, 1.5Mbit SRAM and additional
distributed SRAM in the FPGA fabric
- External SDRAM memory controller
- Peripherals include triple-speed Ethernet, USB 2.0, SPI, CAN, DMAs,
I2Cs, UARTs and timers
- 16 x 5Gbps SERDES (can be evaluated through SMP connectors,) PCIe
Gen2 x4 and XAUI/XGXS+ native SERDES
- Provides the most general purpose and 3.3V I/Os in the industry;
ability to evaluate DDR and GPIO performance
- Build PCI Express® endpoint applications through the X4 PCIe
Gen1/Gen2 edge fingers provided on the board
• IEEE 1588 and Synchronous Ethernet packet clock network synchronizer
- Features four independent clock channels, frequency, and phase sync
over packet networks and physical layer equipment clocks
• PD70201 PoE
- Up to 47.7W of power
- Power supply module required: PD-9501G/AC (not supplied)
• Precision analog-to-digital converter (ADC)
- 16-bit, 500 kSPS, eight channel, single-ended for mixed signal power
- 512 MB of DDR3 memory on-board
- 256 MB for ECC
- 16MB of SDRAM
• eMMC and 4GB NAND flash memory
• SPI flash and 8MB modules
The SmartFusion2 M2S050 and M2S050T devices are in full volume production and available for order now, with the remaining family members scheduled to begin shipping through the remainder of 2013 and early 2014. The SmartFusion2 development kit, part number SF2-DEV-KIT-PP, is available for US $1,800. For additional details on the development kit visit http://www.microsemi.com/soc/products/hardware/devkits_boards/smartfusion2_dev.aspx. For more information about Microsemi's SmartFusion2 SoC FPGAs, visit www.microsemi.com/smartfusion2, contact your local sales representative or email email@example.com.
About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces, all on a single chip.
About SmartFusion2 Development Kits
Designers can take advantage of the SmartFusion2 development kit to prototype highly integrated systems leveraging the SmartFusion2 SoC FPGA with Ethernet, PCI Express, USB, CAN and other transceiver interfaces. The RoHS-compliant kit includes Microsemi's cutting-edge IEEE 1588/Synchronous Ethernet clock synchronizer and PD70201 Power-over-Ethernet (PoE) controller, providing product developers with a full-featured solution for applications that encompass industrial motor control and networking, timing and synchronization, GbE/10GbE switching, mixed-signal power management, wireless backhaul, wireline access and more. An industry-standard fixed mobile convergence (FMC) connector is also included to enable Internet connectivity and use with third-party adaptor cards.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
Director of Corporate Communications
Beth P. Quezada
Web Site: http://www.microsemi.com