Microsemi Announces Collaboration with Broadcom to Expand Broadband Product Portfolio for Next Gen xDSL Applications

New Reverse Power Feed Technology is a Critical Technology for Affordable FTTdp and G.fast Deployments in Communications-based Solutions

ALISO VIEJO, Calif. - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced at the Broadband World Forum (BBWF) 2014 its new reverse power feed (RPF) technology, a critical technology for FTTdp and G.fast deployments.

G.fast, the new xDSL standard for 1gbps over copper, has a maximum expected range of 250 meters (m). In order to achieve the highest data rates with G.fast, shorter loop lengths are required which leads to the need for fiber to the distribution point, or FTTdp. These fiber-fed distribution point units (DPUs) in some cases will require reverse power feed, either due to the location of the DPU, regulations of countries or economic reasons related to power grid hookup and monitoring the grid with a smart meter. See more information about the benefits of reverse power feed at http://www.microsemi.com/product-directory/ics/3551-reverse-power-feeding. RPF technology was developed with G.fast in mind, but is backwards compatible with VDSL2.

Microsemi's RPF for DSL applications demonstrated at BBWF, are designed to be used in conjunction with the VDSL2 and G.fast chipsets from Broadcom Corporation (Nasdaq: BRCM).

"We're excited to leverage our expertise in both DSL and remote powering applications to expand Microsemi's portfolio in the broadband market in collaboration with Broadcom," said Iris Shuker, director of product line management at Microsemi. "PD81001 RPF PSE used in the CPE paired with PD70101 RPF PD used in the DPU are based on mature technology which is being standardized in ETSI and BBF, and enables fast deployment of advanced DSL technologies with reverse power feed. Our solution is based on a metallic-signature handshake protocol and provides Broadcom's DSL devices with inherent reliability and cost advantages over more complex communication based solutions."

"Broadcom is enabling advanced DSL broadband solutions with data rates that can reach 1 Gigabit per second," said Jim McKeon, senior director of product marketing, Broadband Carrier Access at Broadcom. "Microsemi's new RPF solutions simplify the deployment of FTTdp, allowing operators to reduce CAPEX and in turn foster the development of even more cost-effective DSL solutions."

About Reverse Power Feed Products

Microsemi RPF IC's key technical features:

    --  PD81001 is RPF PSE chip with integrated low Rdson FET

        --  Only 10 external components with built in 3.3VDC output

        --  Supports 10, 15, 21 and 30 watt RPF classes with single DC voltage

            input (32-57 VDC)

        --  Provides powered device protection such as over load, under load,

            over voltage, over temperature and short circuiting

        --  Inherent phone off-hook protection

        --  PSE line monitoring capability through SPI

    --  PD70101 is RPF PD chip with integrated PWM controller

        --  Integrated low Rdson isolating FET switch with inrush current limit

        --  Over load and short circuit protection

        --  Signature resistor is disconnected upon detection

        --  Two out-of-phase driver stages for efficient synchronous

            rectification or active clamp

More information on Broadcom's xDSL Solutions, are available at Broadband World Forum 2014, taking place October 21-23 in Amsterdam at booth #MR7.

Packaging and Availability

PD81001 is fixed at 4 x 5 mm 24-pin QFN package. PD70101 is fixed at 5 x 5 mm 32-pin QFN package. The RPF ICs are commercially available. For more information please contact Microsemi at sales.support@micrsosemi.com.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.


Microsemi Corporation

Contact: Richard Round, Sr. Manager, Marketing Communications, 949-380-6135, or Beth P. Quezada, Communications Specialist, 949-380-6102, press@microsemi.com

Web Site: http://www.microsemi.com


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