Microscopy System analyzes full wafers up to 300 mm.
Press Release Summary:
Helios 1200 Full Wafer DualBeam(TM) System accelerates time to data for failure analysis, process development, and process control in semiconductor and data storage manufacturing. System combines scanning electron microscope image resolution and fast switching between imaging and ion beam milling to deliver cross-sectional analysis of structures and defects. Included iFAST automation software optimizes quality and consistency of multiple, site-specific samples in single session.
Original Press Release:
FEI Announces New Helios NanoLab 1200 Full Wafer DualBeam Solution
Advanced DualBeam technology accelerates time to data for failure analysis, process development and process control in semiconductor and data storage manufacturing
Hillsboro, Ore./July 13, 2009 - FEI Company (Nasdaq: FEIC), a leading provider of atomic-scale imaging and analysis systems, today announced the newest member of the Helios NanoLab(TM) Family - the Helios 1200 Full Wafer DualBeam(TM) system. The ability of the Helios 1200 to analyze full wafers up to 300 mm improves the efficiency of semiconductor and data storage failure analysis and manufacturing support labs that need to deliver accurate data quickly to the production floor.
"We've designed the new Helios 1200 DualBeam to provide the maximum productivity for failure analysis, process development and process control requirements," said Larry Dworkin, product marketing manager for FEI's full wafer systems. "The ability to introduce full wafers directly into the system allows users to navigate directly to multiple features of interest based on design data or information from other inspection and defect detection tools. Fast switching between imaging and milling permits precise, efficient control of the cross sectioning process. And imaging resolution significantly better than any other instrument in its class ensures superior analytical results."
The Helios 1200 combines world-class scanning electron microscope (SEM) image resolution and extremely fast switching between imaging and ion beam milling to deliver rapid, reliable, efficient cross-sectional analysis of structures and defects. Its ability to accommodate full wafers up to 300 mm eliminates the time required to re-establish the navigational coordinate system when working with wafer pieces.
"In the nearly two years since its introduction, our small-chamber Helios NanoLab DualBeam systems have been installed at every leading edge fab in the world," said Rudy Kellner, vice president and general manager of FEI's Electronics Division. "Now, for the first time, we can offer the same performance in a full wafer system."
When the analysis demands the higher resolution capability of a dedicated scanning transmission electron microscope (S/TEM), FEI 's Multiloader(TM) technology enables fast and secure sample transfer. FEI's new automation software product, iFAST, improves the quality and consistency of multiple, site-specific samples in a single session at a cost-per-sample that is competitive with conventional SEM bulk sample preparations. Optional energy dispersive X-ray spectrometry (EDS) on thin samples offers compositional analysis with very good spatial resolution.
The optional OmniProbe micromanipulator allows in situ extraction of prepared TEM lamella. The OmniProbe 300's new in-chamber needle exchange process eliminates the need to break chamber vacuum to obtain a new probe.
The new Helios NanoLab 1200 DualBeam system is available now.
About FEI
FEI (Nasdaq: FEIC) is a leading diversified scientific instruments company. It is a premier provider of electron and ion-beam microscopes and tools for nanoscale applications across many industries: industrial and academic materials research, life sciences, semiconductors, data storage, natural resources and more. With a 60-year history of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams(TM), which combine a SEM with a focused ion beam (FIB). FEI's imaging systems provide 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Angstrom (one-tenth of a nanometer) level. FEI's NanoPorts in North America, Europe and Asia provide centers of technical excellence where its world-class community of customers and specialists collaborate. FEI has approximately 1800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.
