Microelectronic Packaging Service handles volume manufacturing.
Press Release Summary:
Microelectronic assembly processes include wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high-power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids. Services include process development, prototyping, volume assembly, and test. Once process is refined and optimized, volume production is performed.
Original Press Release:
High Value-Added Microelectronic Packaging from Palomar Technologies
Palomar Microelectronics Offers Volume Manufacturing Services
Carlsbad, Calif. - May 10, 2007 - Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will announce its high value-added microelectronic packaging services at SEMICON West 2007 at booth #7514. Palomar Microelectronics is a fast growing segment of the company created by the demand for quick-turn product development, prototyping, test, and assembly services. Microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
Palomar Microelectronics will operate from Palomar's headquarters in Carlsbad, California. Services include process development, prototyping, volume assembly, and test. Processes are developed by Palomar's design, applications, and process engineers and validated on Palomar's automated precision microelectronic assembly equipment. Once a process is refined and optimized, volume production is performed by Palomar Microelectronics.
"As an established manufacturer of capital equipment with thousands of systems operating in the field, Palomar is naturally positioned to support the scalable production of complex microelectronic devices at our own facility," said Palomar's president Bruce Hueners. "Palomar Microelectronics represents the logical progression of an equipment company whose mission is to provide complete solutions for our customers. As a product of years of design and process engineering, Palomar has expertise, equipment, processes, and facilities already in place. A company collaborating with Palomar can take a product from design to volume production at lower cost, shorter time, and lesser risk than doing it themselves. Palomar Microelectronics is highly synergistic to our equipment business as it ensures we provide the most cost-effective and flexible bonding equipment and production services specifically suited to our customer's end application."
About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world's principal suppliers of automated high-precision wire bonders and component placement systems to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, and life sciences industries.
For more information on Palomar Microelectronics, visit www.palomartechnologies.com or contact 760Â-931Â-3600.
Contact the Palomar office in your area:
Palomar Technologies, Inc.
Bradley Benton
2728 Loker Avenue West
Carlsbad, CA 92010
Phone: (760) 931-3600
Fax: (760) 931-5191
bbenton@bonders.com
