Microcontrollers feature on-chip flash memory.
Press Release Summary:
Built around SH-4A CPU core, 32-bit Models SH74504 and SH74513 offer 2 MB and 1.5 MB embedded flash memory, respectively, as well as 512 KB on-ship SRAM, providing support for driver-assist systems in automotive applications. Units operate at 240 MHz, allowing them to achieve processing performance of 432 MIPS. Fabricated using 90 nm process technology, MCUs come in 17 x 17 mm BGA package with 0.8 mm pitch and operate over temperature range of -40 to +125°C.
Original Press Release:
Renesas Technology to Release SH74504 and SH74513 MCUs with On-Chip Large Capacity Flash Memory and SRAM for Automobile Driver-Assist System Control Achieved Industry-Top Operation Speed of 240 MHz
Tokyo, November 5, 2008 - Renesas Technology Corp. today announced the SH74504 and SH74513, 32-bit MCUs with on-chip flash memory for driver-assist system control to achieve "active safety" in automotive applications and offering substantially better performance than comparable earlier products. Sample shipments will begin in February 2009 in Japan.
The SH74504 and SH74513 are built around the SH-4A CPU core, the most powerful in the Renesas Technology SuperH *1 Family. Fabricated using 90-nm process technology, they operate at 240 MHz, which is the fastest in the industry for MCUs with on-chip flash memory. They provide ample memory capacity, combining 2 M bytes for the SH74504 / 1.5 Mbytes for the SH74513 of embedded flash memory and 512 Kbytes of on-chip SRAM. This provides support for driver-assist systems offering enhanced performance by enabling high-speed processing of the large volumes of sensor data required by obstacle detection and collision avoidance applications. These MCUs offer advanced on-chip in-vehicle networking capability with five-channel CAN, *2 and in the SH74504 two-channel FlexRay, *3 a communication protocol for next-generation vehicle control applications.
The features of the SH74504 and SH74513 are summarized below.
(1) 240 MHz high-speed operation to enable superior performance for driver-assist systems
The SH74504 and SH74513 are built around the SH-4A CPU core, which has a proven track record in applications such as car navigation systems. Their maximum operating frequency of 240 MHz is the fastest in the industry for MCUs with embedded flash memory, allowing them to achieve processing performance of 432 million instructions per second (MIPS). This is 1.5 times faster and approximately 2.6 times the operating performance of the earlier M32192, making it possible to build driver-assist systems with even better performance.
(2) Large-capacity on-chip flash memory and SRAM fully operating at high temperatures up to 125°
The SH74504 and SH74513 are fabricated using 90 nm process technology and have up to 2 Mbytes of on-chip flash memory (twice the capacity of comparable earlier products), enabling them to store large programs.
In addition to their large-capacity on-chip flash memory, they have a wide operating temperature range of -40° to +125°, enabling them to tolerate the high-temperature environment demanded by applications such as driver-assist systems.
The SH74504 and SH74513 also have 512 Kbytes of on-chip SRAM, approximately three times the capacity of comparable earlier products. This enables them to handle larger amounts of data, such as milliwave radar data or video data from onboard cameras, and to deliver enhanced processing performance.
(3) Enhanced support for in-vehicle network communication, including on-chip FlexRay functionality
In a driver-assist system, a sensor fusion ECU controls a lot of information detected by sensor electronic control units (ECUs), from milliwave radar and camera sensors, via a CAN network. The SH74504 and SH74513 increase the number of CAN channels from the two of comparable earlier products to five to accommodate the increasing number of sensor ECUs and actuator ECUs in today's high-performance driver-assist systems.
Furthermore, the volume of data transferred is expected to increase rapidly due to coordinated control among in-vehicle systems, and it is possible that the current CAN communication speed will become inadequate. To handle this, the SH74504 implements two FlexRay channels conforming to the next-generation basic standard. FlexRay 2.1 protocol has a higher communication speed than CAN networks and allows for greater flexibility in the amount data which is being transmitted; furthermore with two FlexRay channels the SH74504 allows for redundancy, which is needed in safety critical applications.
(4) Compact (17 x 17 mm) BGA package for a smaller system form factor
The SH74504 and SH74513 employ 17 x 17 mm BGA package that has a mounting area approximately 30% smaller than earlier LQFP product from Renesas Technology. This package has multiplexed pins that can be assigned to more than one function. The number of functions per pin has been increased to six from four in comparable earlier products to provide support for a wider range of applications. The compact BGA package has a 0.8 mm pin pitch and an operating temperature range extending up to 125°, making it a good fit for lightweight, compact, affordably priced in-vehicle systems.
Product Background
In recent years efforts to improve safety and reduce environmental impact have been advancing in the automotive field. "Passive safety" measures (such as Airbags) designed to mitigate the effects of traffic accidents are now being supplemented by "active safety" measures, such as driver-assist systems aimed at avoiding accidents before they occur.
The "active safety" measures are designed to detect danger and avoid accidents in situations such as when the driver's eyes stray from the road or visibility is poor. They are intended to prevent accidents through coordination between the driver and the automobile. In the years ahead such technologies will play an important role in creating a stress-free driving experience by enhancing safety and convenience. Renesas Technology is already mass producing the M32192, a 32-bit MCU with on-chip flash memory that is built around the M32R CPU core and has achieved an impressive track record in the driver-assist system market. Nevertheless, the driver-assist systems of the future will require sensing technologies based on image recognition and milliwave radar; they will incorporate many basic technologies used in common with car navigation systems and other vehicle information devices, including information systems and intelligent transport systems (ITSes). This trend led Renesas Technology, which currently has the top share worldwide *4 in the car navigation system MCU/ MPU market, to develop the SH74504 and SH74513 using the well-established SH-4A CPU core to meet demand for driver-assist systems with even higher performance. Developers already using Renesas Technology products incorporating the SH-4A will be able to utilize advanced elemental technology they already possess and to develop new systems in a short timeframe.
Product Details
Both the SH74504 and SH74513 have an on-chip floating-point processing unit (FPU) with a maximum operating frequency of 240 MHz. The FPU supports single- and double-precision calculations and achieves a maximum operation performance of 1.68 GFLOPS (giga [billion] floating-point operations per second) in single-precision mode. Hardware support for vector and sine or cosine arithmetic computations translates into high-speed calculation processing.
In addition to their large on-chip flash memory capacity, both MCUs consume only 1.5 watts of power when operating at 240 MHz. This contributes to better system performance and lower heat generation.
In addition, the SH74504 and SH74513 integrate the following peripheral functions required by driver-assist systems.
(A) On-chip functions for onboard camera control
The three-channel direct RAM input interface (DRI) function supports direct parallel connection at up to 40 Mbps from a CMOS camera with a maximum of wide video graphics array (WVGA) resolution to on-chip SRAM as a camera interface for the lane departure warning system (LWDS), and a one-channel I 2C function is provided for camera settings. The full 512 Bytes of on-chip SRAM is sufficient to store the data for an entire photo, thereby contributing to more compact system size and reduced cost.
(B) On-chip functions for vehicle milliwave systems
The on-chip peripheral functions include a parallel DAC controller (PDAC) circuit for controlling the D/A converter required by a driver-assist system employing milliwave radar, a parallel selector (PSEL) circuit for channel control of a high-speed A/D converter (ADC), a DRI circuit ideal for capturing data from a high-speed external AD converter, a TOU timer for controlling a brushless DC motor (BLDC) for mechanical milliwave scanning control, and a 65-channel ATU-IIIS (Advanced Timer Unit III) multifunction timer unit suitable for timing control. These functions make it easier to realize a more compact system size and reduced cost.
(C) On-chip port-to-port communication function ideal for multi-CPU configurations
In response to the constantly rising performance demands on driver-assist systems, the SH74504 and SH74513 incorporate the following communications functions.
o a direct RAM input (DRI) and direct RAM output interface (DRO) to minimize performance drag on the MCU's CPU caused by CPU-to-CPU communications functions
o a bus controller that supports selection of the optimal data bus width (8, 16, 32 bits) when utilizing an external bus
o serial communication interfaces (SCIF) with FIFO
There is also an on-chip direct memory access controller (DMAC) supporting data transfer to external bus areas to enable management of the above communication functions. By combining these functions it is possible to utilize the performance of the SH-4A CPU to the full and to achieve improved system performance.
Development Environment
Compilers, the E10A-USB on-chip debugging emulator, flash development toolkits, and starter kits manufactured by Renesas Technology are available for use in system development. A variety of additional development tools are available from third-party vendors.
Renesas Technology plans to continue to respond to market demand by developing new products with a range of flash memory capacities and package options as well as higher operating frequencies, better performance, and more advanced functions for the systems of today and tomorrow.
Notes:
1. SuperH(TM) is a trademark of Renesas Technology Corp.
2. CAN (Controller Area Network): An automotive network specification promoted by Robert Bosch GmbH of Germany.
3. FlexRay(TM): A communication protocol for next-generation vehicle control applications that is promoted by the FlexRay Consortium. FlexRay is a registered trademark of Daimler AG.
4. Source: Renesas Technology estimate based on statistics from Strategic Analytics Inc.
* Other product names, company names, or brands mentioned are the property of their respective owners.
Typical Applications
o Automobile equipment control (driver-assist systems, etc.)
Prices in Japan *For Reference
Product Name Product No. Package (Size) Sample Price [Tax Included] (Yen)
SH74504 R5F74504KBG 292-pin BGA (17 mm x 17 mm) 15,000
SH74513 R5F74513KBG 292-pin BGA (17 mm x 17 mm) 14,000
Specifications
Product name SH74504 SH74513
Product No. R5F74504KBG R5F74513KBG
Power supply voltage 1.5 V (internal)/3.3 V/5 V, 1.5 V (internal)/3.3 V, 1.5 V (internal)/5 V
Max. operating frequency 240 MHz
Processing performance 432 MIPS, 1.68 GFLOPS (operating at 240 MHz)
CPU core SH-4A
Operating temperature range -40 to +125°
On-chip ROM (flash memory) 2 Mbytes 1.5 Mbytes
On-chip RAM High-speed RAM: 8 Kbytes + 16 Kbytes, medium-speed RAM: 512 Kbytes
Cache memory Separate, 32 Kbytes for instructions/32 Kbytes for data,
4-way set associative
External bus interface Local bus state controller:
o Supports connection to SRAM or ROM.
o Bus width selectable among 8, 16, and 32 bits.
o Max. operating frequency: 40 MHz
External memory area:
o 64 Mbytes x 2, 32 Mbytes x 1 (max.)
FlexRay 2 channels ―
Main on-chip peripheral functions Timer ATU-IIIS: 65 channels
On-chip watchdog timer
12-bit A/D converter: 2 modules (16 channels/ module, 8 channels/ module )
Direct memory access controller: 12 channels
Direct RAM input interface (DRI): 3 channels
Direct RAM output interface (DRO): 1 channel
Parallel DAC control interface (PDAC): 1 channel
Parallel selector (PSEL): 1 channel
Serial communication interface (SCIF/I 2C, etc.): 8 channels
Controller area network (CAN): 64 mailboxes x 5 channels
Clock oscillator: Built-in multiplier PLL
On-chip debug function
RAM monitor function
Package 292-pin BGA (17 mm x 17 mm, 0.8 mm pin pitch)
*** Information contained in this news release is current as of the date of the press announcement, but may be subject to change without prior notice. ***
