Micro-D and Micro Circular Products are vibration resistant

Press Release Summary:

Suitable for military, aerospace, security and petroleum applications, Micro-D and Micro Circular products come with lightweight aluminum ratchet-coupling shell. Providing ratchet locking system, unit offers quick and secure coupling. With high density Micro Circular connectors, Micro-d is watertight to IP68. With reduce size and weight, device offers rugged connectors and interconnect solutions.

Original Press Release:

Omnetics introduces new Low-Profile Micro-D and Micro Circular Products

Harsh-environment applications encounter increased pressure to reduce size and weight while providing a rugged connectors and interconnect solutions. To address these issues for the military, aerospace, security, petroleum, and other applications Omnetics has expanded our Mil-STD-83513 Micro-D product family to include Low-Profile Micro-Ds. Additionally the Micro Circular connector family now offers a lightweight aluminum ratchet-coupling shell.

The Low-Profile Micro-Ds offer the same rugged performance for shock, vibration, and current carrying capacity as the traditional Micro-D but in a smaller lighter form factor. These compact connectors aide in the design of compact devices by reducing the amount of space needed for the interconnect solution.

Another option for compact devices is Omnetics high density Micro Circular connectors and the addition of the lightweight ratchet locking housing. This new lightweight aluminum housing option to the micro circular line uses a ratchet locking system that provides quick and secure coupling, is watertight to IP68, and is vibration resistant.

For more information please see us at: www.omnetics.com

About Omnetics Omnetics manufactures a complete line of High-speed digital Micro-miniature, Nano-miniature, and Hybrid connectors, wire harness and cable assembly solutions. These rugged Mil-Spec based Micro-D, Nano-D, Circular, and strip connector solutions can aid in the SWaP design requirements of your interconnects while increasing the number of contacts for high speed compact circuitry in mission critical applications and withstand harsh environments.

CONTACT: Scott Unzen,


ph. 763-746 -8744


All Topics