Memory Test System addresses high-volume DDR3-SDRAM devices.
Press Release Summary:
With maximum test speeds of 3.2 Gbps and data transmission speeds of over 1 Gbps, T5503 is deigned for package testing of up to 128 DDR3-SDRAM devices simultaneously. It has semiconductor circuitry that utilizes CMOS technology and is also suited for testing GDDR3 and GDDR4 devices. Support is also provided for source-synchronous test with use of multi-strobe technology, which measures phase difference between data output from device and reference clock signal at each clock cycle.
Original Press Release:
Advantest Introduces New T5503 Memory Test Solution for Low-Cost, High-Volume Production of Next-Generation High-Speed DDR3-SDRAM Memory
TOKYO, April 23 -- Advantest Corporation today announced its new T5503 high-throughput memory test system, boasting the industry's highest parallel test capability of up to 128 devices. The T5503 was developed specifically to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM memory. The memory tester will be available from August 2008 and will also be on display at the "Advantest Tour de Force 2008" exhibition to be held at the Tokyo International Forum, June 3-5.
Adoption of Next-Generation DDR3-SDRAM Necessitates Low-Cost Test Solution
As computers become more and more sophisticated, DRAM, used largely as the main memory storage in computers, is continually being replaced with new generations of products that have ever increasing capabilities. The race to achieve higher device speeds and multiple functionality is rapidly advancing in high-performance PCs as the demand for lifelike graphics with audiovisual equipment, including digital TVs and game consoles, continues to escalate. Consequently, these and other machines are driving a shift toward increased employment of very high-speed memory devices, such as DDR3-SDRAM.
Next-generation DDR3-SDRAM boasts low power consumption through a reduced operating voltage of 1.5V, compared to the DDR2-SDRAM's 1.8V, as well as higher speed and higher volume data processing. Because of these generational advantages, manufacturers are transitioning to DDR3-SDRAM, and it is predicted to be in high demand in a wide variety of fields, ranging from high-end desktop computers to notebook computers and digital consumer electronics. As a result, price competition between IC manufacturers is predicted to escalate, driving an increased demand for volume-production solutions that deliver lower overall cost-of-test.
The introduction of the T5503 reinforces Advantest's market leadership in delivering advanced technology solutions for its global customers' next-generation test requirements.
Parallel test of up to 128 DDR3-SDRAM devices
The T5503 enables package test of up to 128 DDR3-SDRAM devices simultaneously. This is double that of the company's previous models, enabling a major reduction in test costs for high volume production lines. Furthermore, with maximum test speeds of 3.2Gbps and data transmission speeds of over 1Gbps, it is the fastest in the industry, making it an ideal solution for high-volume production testing of DDR3-SDRAM, as well as for GDDR3 and GDDR4.
40% reduction in space and 45% reduction in power consumption
The tester's semiconductor circuitry makes full use of the latest CMOS technology to achieve greater packaging density, reducing the footprint by approximately 40% over the previous model, and leading to space savings in high-volume production lines. Power consumption has also been reduced by approximately 45% compared to the system's predecessor, enabling environmentally friendly operation.
Equipped with Advantest's unique multi-strobe capabilities
Advantest's proprietary multi-strobe capabilities, introduced in the company's previous model, T5501, have been further enhanced in the T5503. Supporting source-synchronous test with the use of multi-strobe technology that measures the phase difference between data output from the device and the reference clock signal at each clock cycle, the system provides high-speed, high-precision test.
Key Specifications
Test Devices: DDR3-SDRAM, GDDR3, GDDR4 etc.
Parallel Test Capacity: Up to 128 units
Maximum Test Speed: 3.2Gbps
About Advantest
Advantest Corporation is the world's leading automatic test equipment supplier to the semiconductor industry, and also produces electronic and optoelectronic instruments and systems. A global company, Advantest has long offered total ATE solutions, and serves the industry in every component of semiconductor test: tester, handler, mechanical and electrical interfaces, and software. Its logic, memory, mixed-signal and RF testers and device handlers are integrated into the most advanced semiconductor production lines in the world. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. Among them, Advantest America, Inc. is based in Santa Clara, CA, and Advantest (Europe) GmbH is based in Munich, Germany. More information is available at www.advantest.com
CONTACT: Amy Gold of Advantest America, Inc., +1-212-850-6670, a.gold@advantest.com
