MEGACAP Type MLCCs Now Feature Metal Lead Frames
Press Release Summary:
CA Series MEGACAP Type Multilayer Chip Capacitors are offered with C0G, X7T, X7S, and X7R temperature characteristics. The CA series capacitors offers capacitance ranging from 20 nF to 150 µF with rated voltages from 25 V to 1000 V. Units are suitable for resonant circuits, smoothing and decoupling applications. Capacitors are designed to withstand against board flexure and solder cracks from thermal shocks and provide low ESR with high ripple current capability.
Original Press Release:
Multilayer Ceramic Chip Capacitors: CA Series of Stacked MEGACAP Type MLCCs with High Capacitance and Low ESR
- Broad capacitance range from 20 nF to 150 µF
- Available with C0G, X7T, X7S, and X7R temperature characteristics
April 3, 2018
TDK Corporation has developed a new series of vertically stacked MEGACAP Type MLCCs that combine high capacitance and low ESR. The new CA series offers rated voltages from 25 V to 1000 V and covers a capacitance range from 20 nF to 150 µF. The new MLCCs are available with C0G, X7T, X7S, and X7R temperature characteristics. Thanks to their high capacitance values, the new capacitors are suitable for the resonant circuits of wireless and plug-in charging systems, for example, for industrial vehicles and robots. They can also be used in smoothing and decoupling applications in industrial equipment. Production of the CA series began in April 2018. Automotive grade products will be introduced after mid-2018.
The MEGACAP Type MLCCs feature metal lead frames attached to the electrode ends of the components to protect against board flexure cracks and solder cracks from thermal shocks. The metal material of the terminal has also been optimized to lower the ESR and achieve a higher ripple current capability. In order to enable a low profile with increased capacitance, TDK has adapted its MEGACAP stack design so that the MLCC elements are stacked side by side. The vertically stacked design enables stacks with three or even more elements. Hybrid joints between the metal terminals and the MLCC are both soldered and clamped to prevent the individual MLCC elements from falling out of the lead frame at the increasingly higher reflow temperatures. The CA series will be available initially with 2x and 3x stacks. In the future the lineup will be expanded with 5x stacks. TDK offers a broad portfolio of MLCCs for a wide range of applications. TDK will continue to place a special focus on the development of technologically superior automotive grade MLCCs.
Main applications
- Resonant circuits for wireless and plug-in charging systems
- Smoothing and decoupling applications in industrial equipment
Main features and benefits
- High capacitance enabled by stacked design
- Low ESR due to optimized terminal material
Key Data
Type Temperature characteristic Rated voltage [V] Capacitance [F] Stacked elements Dimensions [mm]
CAA572C0G3A203J C0G 1000 20 n 2 2x stack: 6.1 x 5.6 x 6.4
CAA572C0G3A303J 30 n 2 3x stack: 6.1 x 8.4 x 6.4
CAA572C0G3A443J 44 n 2
CAA572C0G3A663J 66 n 2
CAA573C0G3A993J 99 n 3
CAA572C0G2J204J 630 200 n 2
CAA573C0G2J304J 300 n 3
CAA572X7T2J105M X7T 630 1 μ 2 2x stack: 6.1 x 5.0 x 6.4
CAA573X7T2J155M 1.5 μ 3 3x stack: 6.1 x 7.5 x 6.4
CAA572X7T2W225M 450 2.2 μ 2
CAA573X7T2W335M 3.3 μ 3
CAA572X7S2A336M X7S 100 33 μ 2
CAA573X7S2A476M 47 μ 3
CAA572X7R1V107M X7R 35 100 μ 2 2x stack: 6.4 x 5.0 x 6.8
CAA573X7R1V157M 150 μ 3 3x stack: 6.4 x 7.5 x 6.8
CAA572X7R1E107M 25 100 μ 2
CAA573X7R1E157M 150 μ 3
About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio includes passive components, such as ceramic, aluminum electrolytic and film capacitors, ferrites and inductors, high-frequency products, and piezo and protection components, as well as sensors and sensor systems and power supplies. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK's further main product groups include magnetic application products, energy devices, and flash memory application devices. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2017, TDK posted total sales of USD 10.5 billion and employed about 100,000 people worldwide.
Further information on the products can be found under https://product.tdk.com/info/en/catalog/datasheets/mlcc_commercial_megacap_ca_en.pdf.
Contacts for regional media
Region Contact Phone Mail
Japan Mr. Yoichi OSUGA TDK Corporation Tokyo, Japan +813 6852-7102 pr@jp.tdk.com
ASEAN Ms. Jiang MAN TDK Singapore (Pte) Ltd. Singapore +65 6273 5022 asean.inquiry@sg.tdk.com
Ms. Pei Lu LEE
Greater China Ms. Clover XU TDK China Co., Ltd. Shanghai, China +86 21 61962307 pr@cn.tdk.com
Europe Mr. Frank TRAMPNAU TDK Europe GmbH Duesseldorf, Germany +49 211 9077 127 frank.trampnau@eu.tdk.com
America Ms. Sara M. LAMBETH TDK Corporation of America Irving, TX, USA +1 972-409-4519 sara.lambeth@us.tdk.com
