Manncorp's 'Auto-Dip' Lead-Free Mass Soldering Replaces Manual Methods

Auto-Dip from Manncorp replaces tedious hand-soldering while batch soldering PCBs of any shape without fixtures. The bench-top system is microprocessor-controlled, with process times ranging from 2 to 12 seconds.

A new lead-free solder dipping system is reportedly finding wide acceptance among PCB through-hole assemblers requiring a higher-throughput mass soldering capability than labor-intensive hand methods.

"Auto-Dip," introduced by Manncorp just a year ago, is a bench-top fixtureless system that simulates the action of a wave system without the possibility of dislodging components when boards of any shape, retained by a grid of needle supports, are dipped into the solder bath. Solder is then evenly applied while surface tension "floats" the PCBs at correct through-hole wetting height. Single boards or pallets of up to 19.3" x 12.5" (490 x 320mm) are processed in just 2 to 12 seconds.

CEO Henry Mann states, "Auto-Dip is much faster than manual soldiering - especially for round or odd-shaped boards that are processed without fixtures. With its low price of $6,155 -- averaging less than one-fourth the cost of a wave machine -- fast payback is a virtual certainty."

Activation is microprocessor-controlled with startup and shutdown times presettable for intervals of up to one-week. Adjustments also exist for dwell time, lead-free compatible temperatures from 220º to 299 Cº, and dipping angle. A built-in motorized skimmer removes dross as needed. For details and animated demonstration of the dipping process, access or

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