Low Profile Capacitor is 50 µm thick.

Press Release Summary:



Designed to be placed beneath components such as ICs, LXFC Series built-in capacitor 1005 size measures 1.0 x 0.5 mm with 50 µm thickness. Unit provides 0.1 µF capacitance and insulation resistance at 4 V of 1 MW, as well as nominal voltage of 4 V. Mounting between LSI bumps, product can be used with component built-in substrates for mobile equipment and modules.



Original Press Release:



New Product is Thinnest in the World! 50 µm Thick Ultra-Low Profile Capacitor



Murata Manufacturing Co., Ltd has developed 50 µm-thick ultra-low profile capacitor, the thinnest of its kind in the world.

Unrivaled this ultra-low profile capacitor, with its thickness of 50 µm, can be placed directly beneath components such as ICs, contributing to making of lighter, thinner and smaller equipment. It further contributes to enhancing equipment features by reducing inductance in wiring patterns.

Background

As mobile equipment and modules continue to become more compact, high density mounting technology is going through a significant advancement. Next generation mounting technology keeps in scope the technology to build passive components into substrates.

Requirements for substrate built-in components such as external electrode material, flatness, laser resistance and toughness, are more stringent compared with surface-mounting components. Based on our leading-edge dielectric material technology and external electrode formation technology, we have succeeded in developing a low profile built-in capacitor 1005 size (1.0 x 0.5mm) 50 µm thin with 0.1 µF capacitance.

Features

o Lowest profile in the world at 50 µm is achieved through our semiconductor manufacturing technology

- Contributes to significantly reducing the thickness of component built-in substrates

o High capacitance in relation to small size and ultra-low profile realized by the leading-edge dielectric thin film material technology

1.0 x 0.5 x 0.05 mm, 0.1 µF

0.6 x 0.3 x 0.05 mm, 0.01 µF

o Higher mounting density due to the location of terminal electrodes on the upper surface

Applications

o Used with component built-in substrates for mobile equipment and modules

o Mounted between LSI bumps

Part number

LXFC*series

Electric characteristic

Dimensions 0.6 x 0.3mm 1.0 x 0.5mm

Thickness 0.05mm 0.05mm

Capacitance (@1kHz) 0.01 µF 0.1 µF

Insulation resistance (@4V) 10 MW 1 MW

Nominal voltage 4 V 4 V

Temperature characteristics X5R X5R

Production

A production capacity of 1 million units per month in April 2010 is scheduled.

More from Materials

All Topics