Low Expansion Epoxy withstands temperatures to 500°F.
Press Release Summary:
Offering dimensional stability, Duralco(TM) 4463 consists of 100% solid system that is mixed, applied, and cured at room temperature. Product resists electricity, chemicals, and moisture. With low odor and no VOCs, epoxy adheres to most glass, ceramics, metals, and plastics, and is suitable for bonding and encapsulated applications.
Original Press Release:
Low Expansion Epoxy Useable to 500°F
Cotronics Corp. has introduced Duralco(TM) 4463, a Low Expansion, 500°F, Room Temperature Curing Epoxy.
Duralco(TM) 4463 resists electricity, chemicals and moisture and has excellent dimensional stability.
It is a user friendly, 100% solid system that you just Mix, Apply and Cure at room temperature. This epoxy features no volatiles, low odor and No VOC's.
Duralco(TM) 4463 has superior adhesion to most glass, ceramics, metals and plastics and is ideal for high performance bonding and encapsulating applications.
For complete specifications and packaging details contact:
Cotronics Corp.
131 47th Street,
Brooklyn, NY 11232
Phone: 718-788-5533
FAX: 718-788-5538
Email: sales@Cotronics.com
www.Cotronics.com
