Press Release Summary:
HysolÂ® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260Â°C reflow applications, FP4549FC heat cures in 30 minutes at 165Â°C, and meets JEDEC Level-3 260Â°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch applications having gaps as small as 25 microns.
Original Press Release:
New Flip Chip Underfill Offers High Compatibility With No-Clean Fluxes
Industry, Calif. - October 31, 2001. Dexter Electronic Materials, a division of Loctite Corporation, has introduced new Hysol® FP4549FC, a package level underfill designed to offer excellent adhesion to flip-chip assemblies containing a wide variety of no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements.
FP4549FC is a high purity, low stress liquid epoxy encapsulant designed for use in fine pitch applications having gaps as small as 25 microns. This "green" material is compatible with no lead assemblies, and offers high adhesion to a variety of substrates including integrated circuit passivation materials, metals, and solder masks. Formulated to perform reliably on semi-rigid and flexible substrates, fully cured Hysol FP4549FC forms a rigid seal that dissipates stress on solder joints and extends thermal cycling performance. This product provides extremely fast capillary flow, flowing a half-inch in a 3-mil gap in just 38 seconds.