Liquid Adhesive is suited for automotive interior assembly.

Press Release Summary:




Solvent-based, one-part Bostik® 1920 adheres to low-energy surface substrates such as rigid polypropylene and polypropylene/polyethylene foams without requiring surface treatment or use of primers. With curing mechanism that reacts to ambient moisture, rubber-based product offers humidity and heat resistance to 230°F. Typical physical properties include Brookfield viscosity rating of 250 cps and total solid content of 21%.



Original Press Release:



New Bostik® 1920 Moisture-Curing, Rubber-Based Liquid Adhesive Assures Aggressive Bonds with Low Surface Energy Substrates



Highly Versatile, Unique One-Component Adhesive Provides Bonding Solution For Challenging Automotive Interiors Applications

MIDDLETON, Mass., Jul. 9, 2004 - The High Performance Polymers (HPP) Division of Bostik Findley, Inc., an international adhesives manufacturer, has developed a new, solvent-based, one-part, moisture curing rubber-based adhesive well suited for automotive interiors assembly and laminations involving low energy surface substrates. Recommended especially for bilaminate bonding for door panels, as well as instrument panels, pillars and bolsters construction, Bostik® 1920 provides tenacious adhesion to difficult to bond low surface energy substrates such as rigid polypropylene and polypropylene/polyethylene foams without requiring surface treatment or the use of primers.

Bostik 1920 features a unique curing mechanism that reacts to ambient moisture and allows for higher heat resistance. When compared to water based adhesives, Bostik 1920 has improved heat and humidity resistance, coupled with excellent adhesion to low energy substrates. Unlike two-part solvent-based systems, this easy-to-handle, one-part system does not require mixing or metering of hazardous amine or isocyanate curatives, and pot life limitations are eliminated.

A highly versatile, multi-task adhesive, Bostik 1920 liquid adhesive can be spray applied, and used for vacuum forming, pressure bonding or as a contact adhesive with flexible and rigid substrates.

When used as a vacuum forming adhesive, Bostik 1920 is applied only to the rigid substrate with an activation temperature of 45° to 50° C (113° to 122° F). For pressure bonding or as a contact adhesive, Bostik 1920 bonds at ambient temperature when applied to both the flexible and rigid substrates.

Typical physical properties include a Brookfield viscosity rating of 250 cps, and a total solid content of 21%. Its heat resistance capability of up to 110° C (230° F) meets typical heat requirement specifications for automotive interior components.

Bostik Findley, Inc. is a unit of TotalSA, a $93-billion multinational company with extensive worldwide interests in oil exploration, petroleum refining and the formulation of specialty chemicals. Bostik Findley is among the world's leading adhesives and sealants manufacturers with production facilities and sales operations in 36 nations across five continents. The HPP Division of Bostik Findley, located in Middleton, Mass., with global headquarters in Leicester, England, produces and supplies on a worldwide basis specialty copolyamide and copolyester resins and hot melts, formulated solvent-based adhesives and unique powder, film and web adhesives for automotive and aircraft interiors, industrial and product assemblies, textiles and industrial laminates.

For more information about Bostik 1920 liquid adhesive, contact Larry Ichimura, Automotive Liquids Product Manager, Bostik Findley HPP Division; Tel: 978-750-7315; Fax: 978-750-7319, or, contact Bostik Findley, Inc., 211 Boston Street, Middleton, Mass. 01949. Telephone: in the USA (888) 571-8558, in Canada (800) 461-0418. Or visit the company's website at bostikfindley-us.com.

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