Press Release Summary:
Formulated to deliver optimal reflow with minimum mid-chip balling, SN100C P810 D4 is based on silver-free and lead-free solder alloy SN100CÂ®. Product also exhibits optimal wetting on all common substrates. Tests indicate that when used in combination with vacuum reflow paste can produce solder joints on 19 x 19 mm pads and joints to power transistors with less than 1% voiding.
Original Press Release:
Nihon Superior to Debut New Low-Voiding Lead-Free Solder Paste
OSAKA, JAPAN - Nihon Superior, a supplier of advanced soldering materials to the global market, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
When reflowed with SN100C P810 D4 large-area solder joints, such as those between power semiconductors and their substrates, there is a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding, this high-reliability lead-free solder paste also is formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates. Our test results indicate that when used in combination with vacuum reflow, this paste can produce solder joints on 19x19 mm pads and joints to power transistors with less than 1 percent voiding.
SN100C P810 D4 is based on Nihon Superior's well known silver-free and lead-free solder alloy SN100C®, which has a track record of more than 13 years of successful delivery of high productivity and high reliability. SN100C is a compliant alloy with high impact strength and has a cost advantage over alloys containing silver. It can be reflowed with profiles similar to those commonly used with alloys such as SAC305 and SAC405.
- Reducing voiding
- Minimum incidence of mid-chip balling
- Excellent wetting behavior
For more information about Nihon Superior's SN100C P810 D4, meet company representatives in Booth #G2 at the IPCA International Expo 2012 (July 25-27 , KTPO, Trade Centre, Bangalore, India).
About Nihon Superior Co., Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.