Lead-Free Batch Oven targets low-volume users.
Press Release Summary:
Using mix of quartz infrared and hot air convection, Model T200A is capable of attaining lead-free temperatures to 300°C and offers ΔT performance envelope of only ±1°C across 14 x 9 in. processing area. Oven will precisely generate and store 20-40 sequential time and temperature settings. In addition to soldering microchips and other SM devices, oven can be used for curing and drying applications.
Original Press Release:
Manncorp's T200A Lead-Free Batch Oven Is Targeted To Low-Volume Users
An economical batch-type lead-free reflow oven designed to meet the needs of short-run assemblers with limited budgets or floor space has been introduced by Manncorp.
Priced at less than $3,500, the T200A is capable of attaining lead-free temperatures to 300ºC and offers a ΔT performance envelope of only ±1 ºC across a generous 360mm x 230mm (14" x 9") processing area.
Using a mix of quartz infrared and hot air convection, said to be ideal for lead-free processing, the oven will solder microchips and other SM devices in accordance with manufacturer-recommended profiles. It will precisely generate and store 20 to 40 sequential time and temperature settings. The oven can also be used for curing and drying applications.
Manncorp officials anticipate that the T200A will find great acceptance among prototypers, labs, schools and others with fast turnaround soldering requirements. For more information, access manncorp.com/reflow-ovens/t200a, or contact sales@manncorp.com.
