Press Release Summary:
- Offered in pre-weighed kits or in FreezeBond® premixed and frozen syringes
- Suitable in applications such as solder replacement, EMIRFI shielding, grounding, die attach, SMD attach, and flip chip attachments
- Sets in ninety minutes at room temperature and within six hours to full hardness
Original Press Release:
Silver Filled Epoxy Adhesive Cures in Minutes
Most assemblies that use Electrically Conductive Epoxy Adhesives require twenty-four hours of cure time or the use of elevated temperatures for faster setting times. The 40-3906 is thin film set within ninety minutes at room temperature and within six hours is close to full hardness. This product has a unique combination of a quick cure speed and a reasonable working time of thirty minutes.
40-3906 is solvent free and filled with unique silver particles. It may be used as a repair material for electrical traces providing better chemical resistance and adhesion than conductive inks. Other common applications include solder replacement, EMIRFI shielding, grounding, die attach, SMD attach, and flip chip attachments. 40-3906 has chemical resistance to jet fuels, DI water, deicing fluids, and many organic solvents.
For easy application, the 40-3906 is packaged in convenient pre-weighed kits and also available in FreezeBond® premixed and frozen syringes.
Thank you for considering the release of the new 40-3906 Electrically Conductive Epoxy Adhesive as a New Product News Release in your publication.
Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 30 years. Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or email@example.com.