At the upcoming BIOME Device event, set to take place December 2nd and 3rd in San Jose, CA, A-Laser, will highlight how its unique capabilities of Laser Direct Structuring (LDS) of Molded Interconnect Devices (MID), are lending new design and functionality freedom to the MID market. From booth 219, A-Laser technology experts look forward to discussing LDS and its MID-enabling capability for improved form and function.
While MIDs are found in multiple markets, they are particularly useful in the medical device arena, where marrying integrated circuit traces and molded thermoplastic parts offers tremendous benefit for devices that can deliver more immediate diagnostic results. Applications include hearing aids, blood glucose meters, remote patient monitoring systems, drug delivery systems, disposable catheter interfaces, neurostimulation controllers, and Integrated Radio-Frequency Identification (RFID) solutions to name a few.
"With projected annual growth of nearly 20%, MIDs are finding new applications in multiple sectors on an almost daily basis," notes Josh Sanders, President of A-Laser. "For the medical device market, this is particularly exciting from a patient care perspective. The ability to integrate a circuit carrier into devices that can be implanted, swallowed or injected opens up huge opportunities to offer more thorough and efficient diagnostics for faster, effective treatment. A-Laser's LDS process is a key enabler for MIDs and we are excited to showcase this capability at BIOMEDevice."
MIDs are injection molded thermoplastic parts that contain integrated circuit traces and provide many design, capability and cost advantages as compared to conventional printed circuit boards. While MIDs will not replace traditional circuitry, they will complement designs that would be impossible to achieve with other technologies. The LDS process activates the material to allow conductive traces onto the plastic surface. The metallization process the starts with a Cu bath after which time Application-specific coatings such as Ni, Au, Sn, Sn/Pb, AG, AG/PD, etc. are possible.
In addition to their LDS technology, A-Laser will be highlighting a new capability made possible by the acquisition of a high tech drilling and routing machine. This new machine is extremely accurate in its linear movement and depth control. One of the goals for this machine is to achieve high quality steps for SMT stencils and the ability to route precise PCB pockets for passive and active components. These pockets are required to be very accurate and this is achieved with a precise depth controlled routing system. The application of this technology goes way beyond SMT Stencils and PCBs; we now have the ability to create 3D features on what normally could only be a 2 dimensional part, ultimately expanding custom design possibilities. This machine is just one of many, in a wide spectrum of technologies that A-Laser has to offer, so speak directly with a representative to learn how we can help overcome your specific challenges.
Show delegates interested in learning more about A-Laser and its LDS process for MID applications and Routing capabilities are invited to meet with the company's technology team throughout the two-day BIOMEDevice event. For more information, visit www.a-laser.com.