Kulicke & Soffa Launches Relmax Gold Bonding Wire
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Fort Washington, PA-September 9, 2008 - Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) ("K&S") today announced the launch of RelMax -a new 2N gold ball bonding wire developed in response to market demand for increased interconnect (IC) reliability, process robustness and reduced costs.
"RelMax provides leading first bond intermetallic stability as attested to by high temperature storage tests. RelMax achieves softer, more concentric Free-Air-Balls for use in low-k and sensitive die applications" notes Dr. Zhang Xi, gold wire product manager "It delivers superior bonding performance for both, the first and second bonds with higher mean-time-between-assist (MTBA) rates compared to other 2N gold wires. RelMax achieves robust bonding processes with significantly improved second bond stitch pull values at lower bonding parameters compared to other 2N wires."
"These features enable customers to exploit lower cost assembly approaches such as the use of smaller wire diameters and metal substrates even for fine pitch applications, while maintaining stable wire-bonding processes and ball-bond reliability. This makes RelMax pre-destined for ultra-fine pitch applications, as well", explains Klaus Dittmer, K&S Vice President, Wire Business Unit GM.
K&S believes RelMax wire will further strengthen its leadership position in bonding wire technology.
The new Relmax will be available in diameters ranging from 15um to 30um. It will be shown for the first time at the K&S booth at SEMI Taiwan, September 9th-11th 2008. Samples are available from K&S.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor assembly equipment, materials, and technology. K&S provides wire bonders, capillaries, wire, die bonders, and die collets for all types of semiconductor packages using wire as the internal electrical interconnections. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor assembly equipment along with the complementing packaging materials and process technology that enable our customers to achieve the highest possible yields and throughput. The ability to provide these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is www.kns.com.
