Ion Implanters utilize electron confinement technology.

Press Release Summary:



GSD Ultra and HC3 Ultra implanters enable high-volume production of ultra shallow junctions. Designed for 200 mm applications, GSD Ultra is based on GSD multi-wafer endstation. HC3 Ultra is designed for 300 mm manufacturing and offers high current processing from 0.2 to 80 keV. Packaging design of both implanters allows for easy maintenance access and maximum tool uptime.



Original Press Release:


Axcelis Launches New Generation of Ultra Low Energy, High Current Ion Implanters; Ultra Systems Enable High-volume Production of Ultra Shallow Junctions


BEVERLY, Mass.--April 10, 2002--Axcelis Technologies, Inc. (NASDAQ:ACLS), today introduced the Ultra line, the next generation of ultra low energy, high current ion implanters. The GSD Ultra and HC3 Ultra bring more powerful low-energy throughput capability to Axcelis' high current ion implantation platform to enable high-volume production of ultra shallow junctions (USJs) and other sophisticated implant applications in and beyond the 100nm technology node.

"Both the GSD Ultra and HC3 Ultra make advanced transistor formation on a volume-production scale possible," said Mike Luttati, COO of Axcelis. "With 100nm device production on the horizon, Axcelis identified a growing need for a fast yet highly reliable ultra low-energy implant capability in USJ applications. The Ultra implanters take the best of Axcelis' high current implant expertise and combine it with increased beam currents and an easy-access maintenance design, translating to new cost-of-ownership and wafer yield advantages for our
customers."

Using Axcelis' proprietary electron confinement technology plus a
new beamline design, the Ultra implanters deliver up to 50% more beam current for leading-edge low-energy implant applications. The new beamline is available in a field upgrade package for Axcelis GSDIII/LED's and HC3's.

The GSD Ultra draws on the benefits of Axcelis' GSD multi-wafer
endstation, widely recognized for its productivity and reliability in volume production fabs worldwide. Additional productivity benefits of the GSD Ultra include a new packaging design for easier maintenance access and maximum tool uptime. "With more than 1,000 units in the field, the GSD endstation is recognized throughout the industry as a dependable, workhorse wafer handling system," said David Duff, vice president and general manager of Axcelis' ion implantation and rapid thermal processing group. "The GSD endstation's benefits are essential in low energy implant applications, where a multi-wafer platform allows for a short, simple and efficient beamline, and provides the best option for achieving excellent uniformity and process control."

In addition to the GSD Ultra for 200mm applications, Axcelis has
introduced the HC3 Ultra for 300mm manufacturing. The HC3 Ultra extends the GSD 200mm platform advantages to 300mm wafers, offering reliable high current processing from 0.2 to 80keV. Like the GSD Ultra, the HC3 Ultra combines Axcelis' low-energy beam transport innovations with a new system layout that allows easy and fast maintenance access for maximum tool productivity and uptime.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo,
Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Company Contact:

Axcelis Technologies, Inc.

Maureen Hart, (978) 787 4266

maureen.hart@axcelis.com

or

Investor Contact:

Axcelis Technologies, Inc.

Mark Namaroff, (978) 787 4000

investor.relations@axcelis.com

or

Agency Contact:

Loomis Group

Dave Snyder, (617) 638 0022

snyderd@loomisgroup.com

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