Interposer integrates PCBeam interconnect technology.
Press Release Summary:
FlexBeam(TM) Tool-Less Copper Flex Interposer is flex-to-board interface that provides densities of .039 in. or less in various pin-matrix configurations. It integrates proprietary high-speed copper flex assembly with Neoconix HD/S PCBeam(TM) interposer and features durable, all-metal spring beams permanently embedded onto FR-4 substrate. Design allows differential signal speeds of greater than 10 Gbps and single-ended speeds of 4 GHz and higher.
Original Press Release:
Molex Introduces HD&S Interposer with Neoconix's PCBeam Interconnect Technology
LISLE, Ill. - January 29, 2009- Molex Incorporated (NASDAQ: MOLX AND MOLXA) and Neoconix have developed a flexible copper high-density and speed (HD&S) interposer in a tool-less, easy-to-use configuration. Available now, Molex's FlexBeam(TM) Tool-Less Copper Flex Interposer is a low-profile, flex-to-board interface that provides densities of 1.00mm (.039") or less in a variety of pin-matrix configurations. The combination of Molex's high speed copper flex assembly integrated with Neoconix's HD&S PCBeam(TM) interposer provides a high-density and high-speed interface for flex-to-PCBA applications.
Molex's FlexBeam(TM) Tool-Less Copper Flex Interposer is ideal for use in the server, mass storage, medical imaging, automatic test equipment (ATE), military command and control center, as well as the military munitions markets. It features durable, all-metal spring beams permanently embedded onto an FR-4 substrate, adding a third dimension (z-axis) to traditional two-dimensional PCB processing, in a high-density configuration.
Its photolithography and etch-based manufacturing process allows excellent dimensional control compared to traditional stamping and molding, and the process is scalable to very fine feature sizes for space constrained applications. Typical configurations provide 0.152mm (.006") of true mechanical compliance per side at 1.00mm (.039") pitch to ensure high reliability. An innovative dual-beam option is also available to provide contact redundancy in high-reliability applications.
The integrated copper flex assembly with PCBeam interposer allows differential signal speeds of greater than 10 Gbps and single-ended speeds of 4 GHz and higher, with cross talk of less than three percent in a pin-matrix configuration. Moreover, the copper flex assembly will provide the contact configuration to allow for board-to-flex pin counts of 500 input/outputs or greater.
For additional information on Molex's FlexBeam Tool-Less Copper Flex Interposer, please visit: www.molex.com/product/flexinterposer.html. For more technical information on Neoconix's HD&S PCBeam interposer, please visit: www.neoconix.com.
About Molex Incorporated
Molex Incorporated is a 70-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com.
