Interconnects feature high-density design.

Press Release Summary:




HD Mezz elevated high-density interconnects (HDAM/HDAF Series) provide solid grid of contacts on 1.2 x 2 mm pitch with up to 299 signals/grounds or 92 signal pairs. Available with 20, 25, 30, and 35 mm stack heights, connectors have pin field design that allows for single-ended or differential routing. Final Inch® Breakout Region Performance Certified PCB layout models are available with performance up to 3.4 GHz (single-ended) and 4.4 GHz (per differential pair).



Original Press Release:



HD Mezz Elevated High Density Arrays Now Available from Samtec



New HD Mezz elevated high density interconnects (HDAM/HDAF Series) provide a solid grid of contacts on 1,2mm x 2mm pitch with up to 299 signals/grounds or 92 signal pairs. These connectors are initially available with 20mm, 25mm, 30mm, and 35mm stack heights with other sizes under development and application specific stack heights available for nominal tooling cost.

The open pin field design allows the connector to be routed single-ended or differentially. Final Inch® Breakout Region Performance Certified printed circuit board layout models are available with performance of up to 3.4 GHz single-ended and up to 4.4 GHz per differential pair depending upon stack height and the signal-toground ratios used in the design.

HD Mezz and SEARAY(TM) (SEAM/SEAF Series open pin field array) are available from both Samtec and Molex.

Pricing begins at .09¢ per pin.

For more information on Samtec's HD Mezz Elevated High Density Arrays, contact:
Samtec, Inc. o P.O. Box 1147 o New Albany, IN 47151-1147o Phone: 1-800-SAMTEC-9. or 812-944-6733 o Fax: 812-948-5047 o Internet: www.samtec.com o E-mail: info@samtec.com.

All Topics