Interconnects are available with 10 to 100 I/Os.

Press Release Summary:



TFM and SFM Series .050 in. pitch interconnects are designed for applications requiring blind mating and/or high number of mating cycles. They are available with board spacings from .236 to 1.472 in. Three-finger Tiger-Eye contacts in SFM Series are stamped and formed with soft Beryllium Copper and heat-treated to optimize spring properties. Tiger Eye LITE three-finger contact is also available formed with Phosphor Bronze alloy.



Original Press Release:


Rugged Micro Interconnects


Samtec's .050" (1,27mm) pitch TFM and SFM Series are designed for applications requiring blind mating and/or a high number of mating cycles. They are available with 10 to 100 I/Os and board spacings from 6 mm (.236") to 12mm (1.472").

Three-finger Tiger-Eye contacts in the SFM Series are stamped and formed with soft Beryllium Copper and then heat-treated to optimize spring properties for maximum cycles. A new Tiger Eye LITE three-finger contact is also available formed with a Phosphor Bronze alloy.

A new latching connector set (TFML and SFML Series) is also now available for increasing separation force. This feature does not permanently lock the connectors together, but increases the separation force by up to four times for small lead count connectors and by over one-and-one-half times for high lead count connectors. Pricing begins $.10 - $.12 cents per mated line.

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