Insulation Displacement Connectors promote quick connection.

Press Release Summary:



Featuring Insulation Displacement Field Attachable design, IDCs enable process of adding connector to cable in few seconds over 2 min. Installation requires one pair of standard wire cutters and removal of 20 mm of outer insulation. Both straight and angled connectors feature bulkhead gasket on threading, providing IP67 protection rating for field connection. On final assembly, blades cut into wire insulation for solid contact with wire.



Original Press Release:



Balluff Introduces Fastest Cable Connection Method



Florence, KY (August 2007) Balluff's new Insulation Displacement Field Attachable design, also known as a Insulation Displacement Connector or IDC provides the fastest method to add a connector to a cable. Tests showed only a few seconds over two minutes was necessary to do the job.

Compared with other methodologies, Balluff IDC's can be attached to a cable five times faster than the solder cup method and two times faster than the screw terminal method - with only a pair of standard wire cutters necessary to do the job.

The components of the Balluff IDC are designed to provide the fastest and easiest connections. For example, only a small amount of torque is needed to secure the gaskets and ensure a proper cut into the insulation. Only 20mm of outer insulation needs to be removed. A bulkhead gasket on the threading provides an IP67 protection rating for the field connection when properly installed. On final assembly, blades cut into the wire insulation for a solid contact with the wire, an improvement over pin contact methodology. Connector styles include straight and angled styles.

Balluff Inc., the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany, is a leading manufacturer of a wide range of inductive, optical, capacitive and magnetic sensors as well as linear position transducers and ID systems. Balluff products for OEM and factory floor solutions are used to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences for industries including metalworking, automotive, plastics, material handling, wood processing, aerospace, electrical, and electronics.

All Topics