Instrument Enclosures offer range of front panel/door options.
Press Release Summary:
Available in 1U–4U sizes with several depths, widths, and configurations, modular Vario and RiPac Enclosures offer front doors with right, left, or bottom hinges, nearly all with lockable security option. Glass door for aluminum and sheet metal enclosure cases comes in smoked acrylic finish. Rear filler panels/doors also come in various options, including versions with cutouts for 120 mm fans. Customization services for panels/doors include powder coating, silk-screening, and custom cutouts.
Original Press Release:
Pixus Offers Multiple Front Panel/Door Options for Electronics Enclosures
Waterloo, Ontario — Pixus Technologies, a provider of embedded computing and enclosure solutions, offers a wide range of front panel/door options for their instrument case enclosures. This includes acrylic glass, solid blanking plate, lockable, and vertically and horizontally hinged types.
The Pixus modular Vario and RiPac brand enclosures come in 1U-14U sizes with several depths, widths, and configurations. The front doors come with right or left side or bottom hinges and nearly all types have a lockable security option.  Pixus offers customization services for the panels/doors, with options for powder coating, silk-screening, and custom cutouts.
The glass door option for Pixus’ aluminum and sheet metal enclosure cases comes in a smoked acrylic finish. The company also has rear filler panels/doors in various options, including versions with cutouts for 120mm fans. Vented panels are optional, available in 1U-3U high strips that provide ventilation for the enclosure.
Pixus also offers modular subracks and 19" rackmount embedded chassis for backplane-based applications. The company specializes in customization of enclosures, backplanes, and components.
A link to the datasheet can be found at http://pixustechnologies.com/assets/Uploads/RiCase-PremierSeries-Datasheet.pdf
About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs.   Pixus also has an extensive offering of VME-based and cPCI-based solutions.  In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.Â
