Indium Corporation will highlight its Reliability Program at its exhibit at Semicon West on July 10-14 at the Moscone Center in San Francisco, CA. Indium's team of experts will be available at booth #8423 to answer questions and provide information.
With the increasing demands for power and miniaturization driving thermal management issues as well as CSP Reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a Process Engineer's goal of optimizing finished goods reliability. This program is customer-driven, reliability-focused, and field-proven.
Products featured at the show will include NF260, the world's first Reworkable, Pb-Free No-Flow Underfill and winner of the Global Technology Award, SMT Magazine Vision Award, and EM Asia Innovation Award. Also featured will be WS-366 Ball Attach Flux, a high-viscosity, water-soluble interconnect flux that offers high yields in the BGA bumping process.
SEMICON West is the largest exposition in North America dedicated to showcasing the technologies that enable the design and manufacture of micro and nano-scale electronics, including semiconductors, micro-electromechanical systems (MEMS), flat panel displays (FPDs) and related devices.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com or email email@example.com.
Anita Brown, Corporate Communications
Indium Corporation of America
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502