Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China.
Pb-free, halogen-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer, and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable performance and stability during usage, a clear, probe-testable flux residue, and a resilient oxidation barrier for strong head-in-pillow and graping resistance, Indium8.9HF is Indium Corporation’s best all-round halogen-free solder paste.
Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability, and challenging RF shield metallizations.
For more information about Indium8.9HF, Indium10.1 or the Indium Pb-free series of solder pastes, visit www.indium.com/indium8.9series or visit Indium Corporation at A-1L25.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com.
Anita Brown, Corporate Communications
34 Robinson Road
Clinton, NY 13323 USA