Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX


Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif.



Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.



The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.



Indium10.1 offers the lowest cost of ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including best-in-class print definition and transfer efficiency, low-voiding performance, and head-in-pillow and graping resistance.



Indium Corporation will be exhibiting at booth 1027.



For more information about Indium10.1 or Indium Corporation’s complete Pb-free Solder Paste series, visit www.indium.com/indium10.1, or email askus@indium.com.



For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.



Contact:

Victoria Cruz-Griffith, Marcom Specialist

Indium Corporation

vcruz-griffith@indium.com

tel: +1.315.381.2052

34 Robinson Road

Clinton, NY 13323 USA

www.indium.com  

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