Indium Corporation Features Heat-Spring® Thermal Interface Material at PCIM


Indium Corporation will feature its Heat-Spring® Thermal Interface Material at PCIM May 20-22 in Nuremberg, Germany.



Heat-Spring® is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling.



Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.



For more information about Heat-Spring® thermal interface materials, visit www.indium.com/heat-spring, or stop by to talk to any of Indium Corporation’s technical experts at PCIM, stand 7-454.



Contact:

Victoria Cruz-Griffith, Marcom Specialist

Indium Corporation

vcruz-griffith@indium.com

tel: +1.315.381.2052

34 Robinson Road

Clinton, NY 13323 USA

www.indium.com

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