IDE Software supports 4th Gen Intel® Core(TM) processors.
Press Release Summary:
With comprehensive tool suite and graphical project development for synchronized utilization of ESA technologies, SYSTEM CASCON™ provides validation and test of complex processor boards. Integrated software development environment enables test, programming, and debug operations without nail or probe access. In addition to JTAG/Boundary Scan/ IEEE 1149.x, key elements of ESA philosophy are Processor Emulation Test, Chip Embedded Instrumentation, Core Assisted Programming, and FPGA Assisted Test.
Original Press Release:
GOEPEL Electronic Prepares Software Platform for Embedded Test and Validation to Support 4th Generation Intel® Core(TM) Processors
GOEPEL electronic, world-class vendor of Embedded System Access (ESA) solutions, announces the support of the 4th generation Intel® Core™ processors (code-named “Haswell”) within the framework of the SYSTEM CASCON™ platform for validation and test of complex processor boards.
SYSTEM CASCON™ is an integrated software development environment with a comprehensive tool suite, uniform GUI, and graphical project development for the synchronized utilization of all ESA technologies, enabling test, programming, and debug operations without nail or probe access (noninvasive). In addition to JTAG/Boundary Scan/ IEEE 1149.x, key elements of the ESA philosophy are, in particular, Processor Emulation Test, Chip Embedded Instrumentation, Core Assisted Programming, and FPGA Assisted Test.
Support of the new Intel processors is based on the recently introduced Intel® Silicon View Technology (Intel® SVT). Intel® SVT is a proprietary method, comprised of various features integrated into Intel processors and chipsets, enabling platform debugging, electrical validation and production test. Complex 4th generation Intel Core processor-based designs with reduced physical access and high-speed signals can now be tested structurally and functionally with high-quality diagnostics. By means of processor-specific VarioTAP® models, these capabilities can be seamlessly incorporated into SYSTEM CASCON. Additional information can be found at goepel.com/en/jtag-boundary-scan/silicon-partner/intel-corporation.html Â
“For more than a decade our system solutions have enabled the utilization of Boundary Scan/IEEE 1149.x features of Intel processors for the test of complex boards. Supporting the 4th generation Intel Core processors based on the Intel Silicon View Technology is the next logical step in the exploitation of additional validation and test opportunities with our Embedded System Access philosophy“, explains Heiko Ehrenberg, Technology Officer for Embedded System Access Technologies and Managing Director at GOEPEL electronics LLC in the US. “For designs applying the 4th generation Intel Core processors, our OEM, ODM and EMS customers can now refer to new SYSTEM CASCON tools to accelerate prototyping, shorten time frames for New Product Introduction (NPI), and ensure the quality of production test with reduced access. As quite a number of these users are also members of the Intel Intelligent System Alliance, this platform enables us to specifically address the needs of, and cooperate with, system developers, system manufacturers, and system integrators.”
In the context of the new product development, GOEPEL electronic has joined the Intel® Intelligent Systems Alliance as General Member. Intel Intelligent Systems Alliance is a global ecosystem of 200+ member companies that provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. Close collaboration with Intel enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.
About the 4th Generation Intel Core CPUs and Intel® SVT
The 4th generation Intel® Core™ processor platform is based on an enhanced Tri-Gate transistor design and 22nm process technology. It provides increased performance, double graphics performance, 50% longer battery life for portable applications and an increased I/O flexibility supporting USB 3.0, PCI Express 3.0 and serial ATA interfaces. Additionally, the architecture enables Intel Silicon View Technology utilization securing design and test quality for OEM and ODM. More information on intel.com
Intel® and Intel Core™ are registered trademarks of Intel Corporation in the United States and other countries.
About GOEPEL electronic:
GOEPEL electronic is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of the more than 8,000 system installations. Founded in 1991 and headquartered in Jena/Germany, GOEPEL electronic employs currently more than 200 employees and generated a revenue of 27 Million Euro in 2012 (ca. $37 Mio). GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found on the internet at www.goepel.com.
Press Contact:
GOEPEL electronic GmbHÂ
Stefan Meissner  Â
Goeschwitzer Str. 58-60/66Â
D-07745 Jena
Tel: +49-3641-6896-739
Fax: +49-3641-6896-944
Email: press@goepel.com
URL: www.goepel.com
