I/O Module offers PC/104 interface for ADLINK SBC.
Press Release Summary:
Ampro by ADLINK MiniModule SIO, designed for Ampro by ADLINK CoreModule® 730, provides PC/104 interface as well as 4 serial ports, including 2 via DB-9 connectors supporting RS-232/422/485 and 2 via pin headers supporting RS-232. It also includes shared parallel port and floppy pin header, PS/2 mouse and keyboard pin headers, and 2 USB 2.0 ports. Ruggedized SUMIT I/O module measures 90 x 96 mm and operates in temperatures from -40 to +85°C.
Original Press Release:
ADLINK Releases Stackable Legacy I/O SUMIT Board for CoreModule® 730 SBC
Ampro by ADLINK(TM) MiniModule(TM) SIO utilizes the ground-breaking SUMIT(TM) interface to provide PC/104 connectivity, additional USB ports, and legacy serial, parallel, floppy, and PS/2 connectivity
San Jose, Calif, September 22, 2009 - ADLINK Technology Inc., a leading global provider of trusted embedded products, today announced the release of the Ampro by ADLINK MiniModule SIO, a SUMIT I/O module specifically designed for the Ampro by ADLINK CoreModule® 730 to provide a PC/104 interface and legacy I/O including serial, parallel, floppy, and PS/2 ports, as well as additional USB 2.0 ports. The MiniModule SIO also utilizes the Ampro by ADLINK Extreme Rugged(TM) design methodology to support an extended operating temperature range of -40 to +85°C.
The revolutionary Ampro by ADLINK CoreModule 730 was developed as a highly legacy-free ruggedized single board computer, and was the first to combine the new SUMIT I/O interface on the ISM(TM) 90x96 mm form factor. The addition of the MiniModule SIO provides greater flexibility to systems based on the CoreModule 730 by expanding its I/O options to include PC/104 and legacy serial, parallel, floppy, and PS/2 interfaces.
"Our goal with the CoreModule 730 was to provide a ruggedized small form factor single board computer based on the ultra low power Intel Atom processor and packed with an enormous amount of data bandwidth via the new SUMIT interface," stated PJ Go, General Manager of the Americas fort ADLINK. "Connectivity options are further expanded with the MiniModule SIO by providing a full mix of legacy I/O, while maintaining the rugged design inherent to the CoreModule family."
About the Ampro by ADLINK MiniModule SIO
The MiniModule SIO is ruggedized stackable 90x96 mm ISM module which provides support for legacy I/O via the SUMIT interface. The MiniModule SIO provides four serial ports - two via DB-9 connectors supporting RS-232/422/485, and two via pin headers supporting RS-232 - a parallel port and floppy pin header (shared), PS/2 mouse and keyboard pin headers, and two USB 2.0 ports. The MiniModule SIO also provides a stack-up PC/104 interface to further add PC/104 connectivity to the CoreModule 730.
About the Ampro by ADLINK CoreModule 730
The CoreModule 730 was the first SUMIT-ISM(TM) product on the market. SUMIT is the new standard expansion interface from the Small Form Factor Special Interest Group (SFF-SIG), www.sff-sig.org. ISM stands for Industry Standard Module, and is a 90x96 mm form factor that specifies a board outline and mounting holes and is completely flexible in terms of expansion interfaces. ISM is also defined by the SFF-SIG. The CoreModule 730 offers a choice of 1.1 GHz and 1.6 GHz Intel® Atom(TM) processors, US15W chipset, DDR2 533 SODIMM RAM up to 2 GB, Gigabit Ethernet, four USB 2.0 ports, IDE interface, CompactFlash socket, 8 general-purpose I/O pins (GPIOs), and integrated graphics engine with H.264 decode acceleration, analog VGA output and 18/24-bit LVDS interface for LCD displays.
Availability
Samples of the MiniModule SIO are currently available.
About ADLINK
ADLINK Technology (www.adlinktech.com) provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
