Hybrid LGA Sockets comply with Intel® Core(TM) i7 processors.

Press Release Summary:




Combining benefits of LGA socket with simplicity of BGA component, LGA 1366 sockets feature 1,366 contacts with 1.016 x 1.016 mm grid, are validated to Intel design guidelines, and ensure efficient soldering to PCB. Each cantilever beam contact is equipped with precise solder ball located on bottom, and cover protects contact array while facilitating vacuum pick and place. Specific applications include CPU interconnects in servers and high-end desktop computers.



Original Press Release:



LGA 1366 Sockets Comply with INTEL® CORE(TM) i7 Processor Family



These hybrid products combine the benefits of an LGA socket with the simplicity of a BGA component and are among the few validated to Intel design guidelines. The LGA 1366 is ideal for servers and high-end desktop computers.

Product Features
  • 1366 contacts with a 1.016mm x 1.016mm grid
  • Available with 15 or 30 gold contact plating
  • Socket housing facilitates efficient soldering to the PCB board

    Applications
  • Servers
  • High End Desktop Computers

    HARRISBURG, Pa. -- Tyco Electronics launches the new surface mount LGA 1156 and 1366 sockets designed to comply with the Intel® Core(TM) i7 processor family. These hybrid products combine the benefits of an LGA socket with the simplicity of a BGA component and are among the few validated to Intel design guidelines. Specific applications of the LGA 1156 include CPU interconnects in desktop computers servers. The LGA 1366 is ideal for servers and high-end desktop computers.

    These products are built to ensure efficient soldering onto the printed circuit board (PCB) as each cantilever beam contact is equipped with a precise solder ball located on the bottom. The sockets are supplied with a cover that protects the contact array and facilitates vacuum pick and place.

    The sockets require an integrated lever mechanism (ILM) that surrounds the socket on the top-side of the PCB. Also required is a robust backplate that prevents the PCB from bowing under the compression load. Tyco Electronics offers these hardware components. Backplates for the LGA 1156 socket are offered in zinc or nickel plating. The LGA 1366 socket also offers backplates for both server and desktop applications.

    For more information on the new sockets, contact Tyco Electronics Product Information Center at http://www.tycoelectronics.com/help.
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