Leading information and communications technology (ICT) infrastructure provider boosts productivity by more than 250%
Huawei Technologies Co., the world’s largest telecommunication equipment and service provider, has chosen Universal Instruments’ FuzionOF™ Platform to automate complex component placement in its server board applications. They have begun scaling FuzionOF in production, replacing manual assembly processes and realizing substantial output gains.
With integrated solutions across four key domains – telecom networks, IT, smart devices, and cloud services – Huawei Technologies is committed to bringing digital to every person, home and organization for a fully connected, intelligent world. Huawei manufactures intelligent serversthat are flexible, balanced, efficient, and feature a modular design for cloud computing virtualization, database, high-performance computing, mission-critical applications, and more workloads.
Huawei selected FuzionOF based on the platform’s inherent speed, repeatability and ability to handle a broad range of components on a single platform, maximizing automation ROI. The new platforms form the foundation of Huawei’s Golden Server production line. They are automating insertion of 16 unique pin-in-paste odd-form components, including VGAs, RJ45s, SATA and PCIE connectors, pin headers, electrolytic capacitors (e-caps), and more. The FuzionOF solution also includes bowl, radial, tray, and track feeder integration.
By transitioning to the high-speed, high-accuracy FuzionOF solution, Huawei has seen significant improvements. Daily printed circuit board (PCB) output has more than tripled, while the first-pass yield rate has been more than 99.5% and downtime less than 1%.
FuzionOF boastsseveral advantages for end-of-line odd-form applications by offering full inspection, consistent placement forces, and having the flexibility to easily transition to new products and requirements. These advantages provide the agility, versatility, yield, and performance to excel in both higher-mix and higher-volume environments.
“We’re thrilled to work together with a world-class partner like Huawei,” said Universal Instruments Vice President of Customer Operations, Brad Bennett. “Automation continues to drive the electronics assembly landscape and we’ve developed our portfolio to meet this challenge head-on. More importantly, we’re positioned to help our customers embrace automation and fortify their leadership positions.” Bennett continued, “FuzionOF will be a tremendous asset for Huawei and we hope it will serve as a cornerstone to continue and expand our cooperation.”
To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com. To learn more about Universal Instruments, China, please contact Sean Lu, General Manager, Greater China at 21-6495-2100 ext. 201 or email@example.com.
About Huawei Technologies
Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. Huawei's end-to-end portfolio of products, solutions and services create lasting value for its customers, working to empower people, enrich home life, and inspire innovation in organizations of all shapes and sizes. With more than 180,000 employees, Huawei operatesin more than 170 countries and regions. Founded in 1987, Huawei is a private company fully owned by its employees.
About Universal Instruments
Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.
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