Press Release Summary:
Used to interconnect PowerPC processors with subsystems in embedded designs, Tundra Tsi110(TM) integrates communications peripherals such as two 4-lane PCI-Express ports, 4 Gigabit Ethernet (GigE) ports, and one PCI-X port. GigE hardware acceleration off-loads host processor and allows all GigE ports to run at full line rate for data plane applications. Software-compatible with Tsi109 and Tsi108, product supports several I/O peripherals, including DDR2 Memory.
Original Press Release:
Tundra Announces High Performance Host Bridge for PowerPC® with PCI Express
New Tundra Tsi110(TM) Integrates PCI Express to Deliver the Industry's Best System Performance, Power and Cost
OTTAWA, Jan. 17 / -- Tundra Semiconductor Corporation (TSX: TUN), the leader in System Interconnect, today announced the Tundra Tsi110 Host Bridge, the industry's highest performing host bridge for PowerPC. The latest addition to Tundra's industry-leading family of host bridges is optimized for a broad range of applications for the wireless and wireline networking, storage and embedded computing markets.
The Tsi110 Host Bridge sets industry benchmarks for performance and power management through an innovative feature set supported by world-class design support. Ideal for power sensitive and cost sensitive applications, the Tsi110 integrates several communications peripherals - including two 4-lane PCI- Express ports, four Gigabit Ethernet ports and one PCI-X port. This high level of integration offers system designers numerous options for I/O connectivity and reduces external component count.
Included in the Tsi110's innovative feature set is Gigabit Ethernet hardware acceleration, which off-loads the host processor and allows the four Gigabit Ethernet ports to run at full line rate for data plane applications. The Tsi110 packaging, ball map, and I/O features were all designed with reliability and signal integrity in mind to ease the challenge of high-speed board designs. The Tsi110 is also software compatible with the Tsi109(TM) and Tsi108(TM), allowing software reuse and accelerating development cycles. The combination of the Tsi110's features, reliability and Tundra's world-class support provides designers with the benefits of greater overall system performance, reduced system design complexity, better integration and superior power efficiency.
"Tundra continues to innovate in this space, and along with the industry, predicts strong growth in the scope of PowerPC's leadership in the markets we serve," says Rick O'Connor, Tundra's chief technology officer. "Tundra is the leader in delivering System Interconnect solutions for greater system performance, power and cost benefits that designers need to build high- performance, scalable designs."
Tsi110 Host Bridge Well Received By Leading PowerPC Processor Vendors
The Tsi110 offers best system performance-per-watt as well as best system performance-per-dollar, making it an ideal companion chip for both Freescale MPC74xx and IBM PPC750xx high performance processors. The combination of the Tsi110's rich feature set, high reliability and Tundra's accessible design support has been well received by the industry's leading PowerPC processing vendors such as, IBM.
"Tundra's new Tsi110 host bridge, when combined with our high-performance MPC7447A/7448 processors, allows customers to leverage high-performance processing performance while optimizing system power," said Glenn Beck, market segment manager for Freescale Semiconductor's Digital Systems Division. "With the PCI Express interface, the Tsi110 enables even more design flexibility for our embedded networking customers and opens up possibilities for greater adoption in a range of applications."
"Tundra's latest addition to their host bridge family is good news for Power Architecture(TM). The new Tsi110 host bridge aligns well with IBM's high performance 750 PowerPC processors," said Ron Martino, director of PPC Standard Products, IBM Systems and Technology Group. "When combined, these technologies offer embedded system designers superior performance and power efficiency required to build optimized systems for a range of next-generation applications."
ORDERING INFORMATION AND DESIGN SUPPORT TOOLS
The Tsi110 Host Bridge will be available for sampling late in 2006 through Tundra's worldwide sales network. Volume pricing for the Tsi110 is under $80USD.
For more information on product feature and benefits, go to tundra.com/tsi110
ABOUT TUNDRA HOST BRIDGES FOR POWER PC
Host bridges interconnect PowerPC processors with subsystems and are a critical component in embedded designs. With over a decade of investment and experience supporting PowerPC-based designs, Tundra Host Bridges for PowerPC have been widely adopted by market leaders. Tundra Host Bridges include, the Tsi109, Tsi108, Tsi107(TM), and Tsi106(TM), and are regarded as the best companion chips for the industry's leading PowerPC processor vendors - Freescale Semiconductor and IBM. The Tsi110 supports several I/O peripherals - PCI Express, PCI-X, DDR2 Memory, and Gigabit Ethernet. To maintain software investment and accelerated development cycles, the Tsi110 is software compatible with the Tsi109 and Tsi108. The Tsi110 optimizes overall system performance, power and cost, while offering best signal integrity and best I/O connectivity.
Tundra Semiconductor Corporation (www.tundra.com) is the global leader in System Interconnect providing world-class support and leading edge semiconductor solutions to the world's foremost communications, networking, storage system, and information technology vendors. Consistently delivering on system level performance promises that reduce time to market, Tundra System Interconnect ensures market advantage in wireless infrastructure, storage networking, network access, military, industrial automation, and information technology applications.
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation (Canada - registration in the United States, European Union, and People's Republic of China pending). Tsi106, Tsi107, Tsi108, Tsi109 and Tsi110 are trademarks of Tundra Semiconductor Corporation. The PowerPC name, Power Architecture name, and the PowerPC logotype are trademarks of International Business Machines Corporation, used under license therefrom. Other registered and unregistered trademarks are the property of their respective owners.
(C) Copyright 2006 Tundra Semiconductor Corporation. All rights reserved. Information subject to change without notice.
CONTACT: Veronica Farmer, Tundra Semiconductor Corporation, Direct: (613) 592-0859 ext. 1771, Mobile: (613) 862-3346, email@example.com