Press Release Summary:
Available in 7-15 mm stack heights and 40-200 circuits, SEARAY Slim Connectors provide dense, 4-row structure leveraging Solder Charge technology and supporting 12.5 Gbps speeds in envelopes commonly limited to 2-row architectures. Units feature narrow profile, which facilitates unobstructed airflow in system. Offered in tin-lead or lead-free designs, connectors are suited for controller card designs, memory expansion, and I/O double densities.
Original Press Release:
SEARAY Slim Four-Row Connectors Offer Flexibility and Headroom for Next-Generation Protocol Improvements
LISLE, Ill. - August 19, 2008 - Molex Incorporated recently introduced SEARAY* Slim - a four-row, high-speed connector that offers flexibility and headroom for next-generation protocol improvements. It is ideal for a variety of applications, including; controller card designs, memory expansion and I/O double densities.
The SEARAY Slim connector provides a very dense four-row structure by leveraging Molex's Solder Charge technology and squeezing 12.5 Gbps speeds in envelopes commonly limited to two-row architectures. Available in 7 to 15mm stack heights and 40 to 200 circuits, its narrow profile facilitates unobstructed airflow in a system. Circuit sizes growing in multiples of 20 pins allow customers to optimize their board density.
SEARAY Slim is a cost effective solution for mezzanine cards and is offered in tin-lead or lead-free designs.
For more information, visit: http://www.molex.com/link/searayslim.html